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Valuation: Strasbaugh

Market Cap 1Cr 86.37L 79.59L 74.5L 1.4Cr 95Cr 1.42Cr 9.4Cr 3.66Cr 46Cr 3.75Cr 3.67Cr 160.19Cr P/E Ratio 2008
-2.77x
P/E Ratio 2009 -1.14x
Enterprise Value 87.6L 75.66L 69.72L 65.26L 1.22Cr 83Cr 1.24Cr 8.23Cr 3.21Cr 41Cr 3.29Cr 3.22Cr 140.32Cr EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
5 years 0
Extreme 0
0.22
10 years 0
Extreme 0
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 14
+2.64%+25.22%+224.14%+305.15% 44TCr
+4.66%+10.58%+122.83%+185.21% 6.82TCr
+4.25%+17.07%+93.19%+156.28% 5.48TCr
+14.09%+10.09%+131.73%+277.78% 4.73TCr
+0.79%+7.75%+114.72%+30.63% 4.43TCr
+0.26%+10.12%+172.83%+198.41% 4.19TCr
+2.96%+16.80%+158.25%+228.43% 2.81TCr
-1.54%+10.80%+361.83%+237.28% 2.72TCr
+7.27%+21.38%+189.79%+137.92% 2.02TCr
Average +3.54%+11.47%+174.37%+195.23% 7.71TCr
Weighted average by Cap. +3.39%+10.99%+192.67%+251.12%

Financials

2008 2009
Net sales 95.54L 82.52L 76.04L 71.18L 1.33Cr 91Cr 1.35Cr 8.98Cr 3.5Cr 44Cr 3.59Cr 3.51Cr 153.05Cr 1.29Cr 1.11Cr 1.02Cr 95.9L 1.8Cr 122.36Cr 1.83Cr 12Cr 4.72Cr 60Cr 4.83Cr 4.73Cr 206.21Cr
Net income -45.08L -38.94L -35.88L -33.58L -62.94L -43Cr -63.91L -4.24Cr -1.65Cr -21Cr -1.69Cr -1.66Cr -72Cr -7L -6L -5L -5L -9L -6.46Cr -10L -63.9L -24.92L -3.15Cr -25.52L -24.98L -11Cr
Net Debt -0.19 -0.16 -0.15 -0.14 -0.26 -17.87 -0.27 -1.77 -0.69 -8.7 -0.71 -0.69 -30.12 -1.24 -1.07 -0.99 -0.92 -1.73 -117.86 -1.76 -11.65 -4.54 -57.37 -4.65 -4.55 -198.64
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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