Valuation : Strasbaugh

Market Cap 1Cr 85.98L 80.89L 73.82L 1.38Cr 95Cr 1.38Cr 9.58Cr 3.71Cr 48Cr 3.76Cr 3.67Cr 154.2Cr P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 87.6L 75.32L 70.86L 64.66L 1.21Cr 83Cr 1.21Cr 8.4Cr 3.25Cr 42Cr 3.29Cr 3.22Cr 135.08Cr EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
1 week+9,09,900.00%
Current month+9,09,900.00%
1 month+9,09,900.00%
3 months+9,09,900.00%
6 months+9,09,900.00%
Current year+9,09,900.00%
5 years 0
Extreme 1.0E-6
0.01
10 years 0
Extreme 1.0E-6
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%+9,09,900.00%+9,09,900.00%+9,09,900.00% 14
+3.98%+7.00%+191.76%+220.47% 38TCr
-1.93%-2.97%+74.91%+228.19% 7TCr
+0.67%+5.52%+99.34%+97.42% 4.79TCr
-2.32%-4.14%+135.38%+231.56% 4.8TCr
-0.56%-2.86%+41.85%+96.91% 3.79TCr
-3.06%-2.85%+257.75%+291.05% 2.73TCr
-0.27%+2.64%+36.93%-22.25% 2.47TCr
-0.20%-1.39%+91.67%+157.04% 2.02TCr
-0.10%+0.68%+73.89%+88.43% 1.83TCr
Average -0.98%-0.13%+91,090.35%+91,128.88% 6.7TCr
Weighted average by Cap. -1.02%-0.99%+151.11%+194.64%

Financials

2008 2009
Net sales 95.54L 82.15L 77.28L 70.53L 1.32Cr 91Cr 1.32Cr 9.16Cr 3.54Cr 46Cr 3.59Cr 3.51Cr 147.32Cr 1.29Cr 1.11Cr 1.04Cr 95.03L 1.77Cr 122.04Cr 1.78Cr 12Cr 4.77Cr 62Cr 4.83Cr 4.73Cr 198.5Cr
Net income -45.08L -38.76L -36.46L -33.28L -62.1L -43Cr -62.42L -4.32Cr -1.67Cr -22Cr -1.69Cr -1.66Cr -70Cr -7L -6L -6L -5L -9L -6.45Cr -9L -65.17L -25.21L -3.3Cr -25.53L -24.98L -10Cr
Net Debt -0.19 -0.16 -0.15 -0.14 -0.26 -17.82 -0.26 -1.8 -0.7 -9.11 -0.71 -0.69 -28.99 -1.24 -1.07 -1 -0.92 -1.71 -117.56 -1.72 -11.88 -4.6 -60.09 -4.66 -4.55 -191.21
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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