Valuation: Strasbaugh

Market Cap 1Cr 87.83L 81.68L 74.95L 1.41Cr 96Cr 1.43Cr 9.7Cr 3.79Cr 47Cr 3.75Cr 3.67Cr 163.69Cr P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 87.6L 76.94L 71.55L 65.66L 1.23Cr 84Cr 1.25Cr 8.5Cr 3.32Cr 41Cr 3.29Cr 3.22Cr 143.39Cr EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
5 years 0
Extreme 0
0.09
10 years 0
Extreme 0
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 14
-4.72%+1.24%+185.06%+287.60% 45TCr
+2.30%+11.82%+123.53%+282.12% 7.93TCr
+3.54%+10.78%+190.86%+338.24% 5.31TCr
-1.63%-1.15%+94.96%+126.31% 4.86TCr
-12.27%-6.00%+42.00%+151.98% 4.59TCr
+6.46%+13.15%+347.37%+455.68% 3.17TCr
-5.94%-6.87%+36.45%-13.45% 3.12TCr
+2.68%-0.17%+149.93%+203.91% 2.08TCr
-1.26%+0.67%+78.74%+115.47% 2.07TCr
Average -1.08%+4.70%+138.77%+216.43% 7.78TCr
Weighted average by Cap. -3.00%+3.03%+162.01%+260.39%

Financials

2008 2009
Net sales 95.54L 83.91L 78.04L 71.61L 1.35Cr 92Cr 1.37Cr 9.27Cr 3.62Cr 45Cr 3.59Cr 3.51Cr 156.4Cr 1.29Cr 1.13Cr 1.05Cr 96.49L 1.81Cr 123.97Cr 1.84Cr 12Cr 4.88Cr 61Cr 4.83Cr 4.73Cr 210.73Cr
Net income -45.08L -39.59L -36.82L -33.79L -63.49L -43Cr -64.46L -4.37Cr -1.71Cr -21Cr -1.69Cr -1.66Cr -74Cr -7L -6L -6L -5L -10L -6.55Cr -10L -65.95L -25.77L -3.22Cr -25.53L -24.98L -11Cr
Net Debt -0.19 -0.17 -0.15 -0.14 -0.26 -18.1 -0.27 -1.82 -0.71 -8.9 -0.71 -0.69 -30.77 -1.24 -1.09 -1.01 -0.93 -1.75 -119.41 -1.77 -12.03 -4.7 -58.71 -4.65 -4.55 -202.98
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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