Valuation: Strasbaugh

Market Cap 1Cr 88.85L 82.93L 75.58L 1.43Cr 96Cr 1.44Cr 10Cr 3.89Cr 49Cr 3.75Cr 3.67Cr 157.72Cr P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 87.6L 77.83L 72.64L 66.21L 1.25Cr 84Cr 1.26Cr 8.79Cr 3.41Cr 43Cr 3.29Cr 3.22Cr 138.16Cr EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
5 years 0
Extreme 1.0E-6
0
10 years 0
Extreme 1.0E-6
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 14
+3.51%+8.56%+88.35%+197.09% 69TCr
+3.08%+11.26%+138.58%+455.88% 43TCr
+1.81%+11.33%+141.50%+287.04% 42TCr
+3.55%+10.39%+82.09%+350.36% 26TCr
-3.82%+12.20%+134.41%+195.99% 18TCr
+2.71%+16.85%+163.24%+823.94% 17TCr
+0.42%+2.00%+337.42%+551.14% 9.77TCr
-2.07%-5.68%+36.17%+244.62% 6.66TCr
+8.00%+12.89%+211.19%+346.75% 6.5TCr
Average +1.68%+6.04%+148.11%+383.65% 23.81TCr
Weighted average by Cap. +2.32%+7.84%+127.08%+341.40%

Financials

2008 2009
Net sales 95.54L 84.89L 79.23L 72.21L 1.36Cr 92Cr 1.37Cr 9.59Cr 3.72Cr 47Cr 3.59Cr 3.51Cr 150.69Cr 1.29Cr 1.14Cr 1.07Cr 97.3L 1.84Cr 123.75Cr 1.85Cr 13Cr 5.01Cr 63Cr 4.83Cr 4.73Cr 203.04Cr
Net income -45.08L -40.05L -37.38L -34.07L -64.26L -43Cr -64.86L -4.52Cr -1.75Cr -22Cr -1.69Cr -1.66Cr -71Cr -7L -6L -6L -5L -10L -6.54Cr -10L -68.24L -26.44L -3.34Cr -25.53L -24.98L -11Cr
Net Debt -0.19 -0.17 -0.16 -0.14 -0.27 -18.07 -0.27 -1.89 -0.73 -9.24 -0.71 -0.69 -29.65 -1.24 -1.1 -1.03 -0.94 -1.77 -119.2 -1.78 -12.44 -4.82 -60.94 -4.66 -4.55 -195.58
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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