Valuation : Strasbaugh

Market Cap 1Cr 86.17L 80.79L 73.75L 1.39Cr 96Cr 1.39Cr 9.59Cr 3.74Cr 48Cr 3.75Cr 3.67Cr 159.97Cr P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 87.6L 75.48L 70.77L 64.61L 1.22Cr 84Cr 1.22Cr 8.4Cr 3.28Cr 42Cr 3.29Cr 3.22Cr 140.13Cr EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
1 week+9,09,900.00%
Current month+9,09,900.00%
1 month+9,09,900.00%
3 months+9,09,900.00%
6 months+9,09,900.00%
Current year+9,09,900.00%
5 years 0
Extreme 1.0E-6
0.01
10 years 0
Extreme 1.0E-6
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%+9,09,900.00%+9,09,900.00%+9,09,900.00% 14
-4.29%-6.23%+187.18%+207.82% 37TCr
-2.85%-2.37%+87.25%+260.22% 7.52TCr
-2.40%+1.24%+155.33%+293.97% 5.22TCr
-0.19%-0.55%+101.07%+89.80% 4.69TCr
-0.72%-3.28%+43.53%+116.37% 4.02TCr
-3.42%-0.63%+252.26%+332.12% 2.88TCr
-3.41%-6.85%+34.05%-17.92% 2.46TCr
-3.53%-1.64%+91.07%+177.46% 2.12TCr
-2.46%-4.11%+189.47%+310.93% 1.92TCr
Average -2.33%-2.20%+91,104.12%+91,167.08% 6.75TCr
Weighted average by Cap. -3.34%-4.04%+153.26%+205.73%

Financials

2008 2009
Net sales 95.54L 82.33L 77.19L 70.46L 1.33Cr 91Cr 1.33Cr 9.16Cr 3.57Cr 46Cr 3.59Cr 3.51Cr 152.84Cr 1.29Cr 1.11Cr 1.04Cr 94.94L 1.79Cr 123.03Cr 1.79Cr 12Cr 4.81Cr 62Cr 4.83Cr 4.73Cr 205.93Cr
Net income -45.08L -38.85L -36.42L -33.25L -62.63L -43Cr -62.83L -4.32Cr -1.69Cr -22Cr -1.69Cr -1.66Cr -72Cr -7L -6L -5L -5L -9L -6.5Cr -9L -65.18L -25.43L -3.28Cr -25.53L -24.98L -11Cr
Net Debt -0.19 -0.16 -0.15 -0.14 -0.26 -17.97 -0.26 -1.8 -0.7 -9.07 -0.71 -0.69 -30.07 -1.24 -1.07 -1 -0.91 -1.72 -118.51 -1.73 -11.89 -4.64 -59.82 -4.66 -4.55 -198.37
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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