Digi International announced the availability of the Digi XBee3 series of next-generation RF modules and cellular modems. Introducing a new micro form factor option capable of supporting greater IoT innovation at the network edge, Digi XBee3 series extends its modular approach to IoT connectivity, enabling the integration of new functions as needs arise and regional requirements change. Included in its micro size, Digi XBee3 also offers MicroPython programmability and dual-mode radios that provide wireless design flexibility and enable easily added functionality for innovative IoT solutions that can be more quickly developed, prototyped and mass-produced. Also available in the existing Digi XBee SMT and through-hole form factors, the Digi XBee3 micro, when installed on interposer boards, automatically provides all the benefits inherent in the industry's smallest RF module capable of supporting the development of truly innovative, smart IoT solutions. Additionally, the through-hole form factor is ideal as a validation and migration platform for those requiring the advanced capabilities and features necessary to speed development, prototyping, or early-production phase. Digi XBee3 Cellular is available in its original, classic through-hole form factor.