Transphorm, Inc. and Weltrend Semiconductor Inc. announced availability of two new GaN System-in-Packages (SiPs). When combined with Weltrend?s flagship GaN SiP announced last year, the new devices establish the first SiP product family based on Transphorm?s SuperGaN® platform. The new SiPs?WT7162RHUG24B and WT7162RHUG24C?integrate Weltrend?s high frequency multi-mode (QR/Valley Switching) Flyback PWM controller with Transphorm's 150 mO and 480 mO SuperGaN FETs respectively.

Like their 240 mO predecessor(WT7162RHUG24A), the devices pair with USB PD or programmable power adapter controllers to provide a total adapter solution. Notably, they also offer several innovative features including the UHV valley tracking charge mode, adaptive OCP compensation, and adaptive green mode control among others that allow customers to design high quality power supplies faster and with fewer components using the simplest design approach. End product manufacturers seek ways to develop new adapters with a reduced bill-of-materials (BOM) that offer versatility, fast charging, and higher power outputs.

Additionally, in many cases they seek to deliver ?one-size-fits-all? chargers with multiple ports and/or multiple types of connections. All of this in smaller, lighter weight form factor.

Some key advantages of Transphorm?s normally-off d-mode SuperGaN platform include best-in-class robustness (+/- 20 V gate margin with a 4 V noise immunity) and reliability (< 0.05 FIT) with the ability to increase power density by 50% over silicon. Weltrend?s elegant SiP designs harness those advantages along with its own innovative technologies to create a near plug-and-play solution that speeds design while reducing form factor size. Weltrend?s SuperGaN SiP family is optimized for use in high-performance, low-profile USB-C power adapters for mobile/IoT devices such as smartphones, tablets, laptops, headphones, drones, speakers, cameras, and more.