Valuation: Strasbaugh

Market Cap 1Cr 87.99L 81.77L 75.08L 1.41Cr 97Cr 1.43Cr 9.71Cr 3.81Cr 47Cr 3.75Cr 3.67Cr 163.79Cr P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 87.6L 77.08L 71.63L 65.77L 1.23Cr 85Cr 1.26Cr 8.51Cr 3.33Cr 41Cr 3.29Cr 3.22Cr 143.48Cr EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-45.39%-.--% - - 14
-4.72%-4.40%+186.75%+293.15% 45TCr
+2.30%+7.72%+128.36%+279.37% 7.93TCr
+3.54%+7.49%+191.60%+333.93% 5.31TCr
-1.63%-5.14%+90.60%+121.81% 4.86TCr
-12.27%-13.74%+42.90%+162.40% 4.59TCr
+6.46%+9.56%+351.05%+449.08% 3.17TCr
-5.94%-8.09%+33.39%-16.03% 3.12TCr
-1.26%-3.90%+83.58%+113.95% 2.07TCr
+2.68%-6.97%+152.56%+199.81% 2.08TCr
Average -5.06%+4.56%+140.09%+215.27% 8.65TCr
Weighted average by Cap. +0.26%+0.26%+163.53%+262.81%

Financials

2008 2009
Net sales 95.54L 84.07L 78.12L 71.73L 1.35Cr 92Cr 1.37Cr 9.28Cr 3.64Cr 45Cr 3.59Cr 3.51Cr 156.49Cr 1.29Cr 1.13Cr 1.05Cr 96.65L 1.81Cr 124.29Cr 1.84Cr 13Cr 4.9Cr 61Cr 4.83Cr 4.73Cr 210.85Cr
Net income -45.08L -39.67L -36.86L -33.85L -63.53L -44Cr -64.59L -4.38Cr -1.72Cr -21Cr -1.69Cr -1.66Cr -74Cr -7L -6L -6L -5L -10L -6.57Cr -10L -66.03L -25.88L -3.22Cr -25.53L -24.98L -11Cr
Net Debt -0.19 -0.17 -0.15 -0.14 -0.26 -18.15 -0.27 -1.83 -0.72 -8.9 -0.71 -0.69 -30.79 -1.24 -1.09 -1.01 -0.93 -1.75 -119.72 -1.78 -12.04 -4.72 -58.69 -4.65 -4.55 -203.1
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
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