MICRO CONTACT SOLUTION CO., LTD. Micro Contact Solution Co., Ltd. Share Price
Equities
A098120
KR7098120009
Semiconductor Equipment & Testing
|
End-of-day quote
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|
5-day change | 1st Jan Change | ||
| 10,560 KRW | -3.74% |
|
+9.32% | -24.41% |
| Sales 2022 | 61.05B 44.81M 3.74B | Sales 2023 | 64.82B 47.58M 3.97B | Capitalization | 116B 85.24M 7.11B |
|---|---|---|---|---|---|
| Net income 2022 | 7.05B 5.17M 431M | Net income 2023 | 7.4B 5.43M 453M | EV / Sales 2022 | 0.41 x |
| Net cash position 2022 | 18.5B 13.58M 1.13B | Net cash position 2023 | 23.38B 17.16M 1.43B | EV / Sales 2023 | 1.43 x |
| P/E ratio 2022 |
6.14
x | P/E ratio 2023 |
15.7
x | Employees | 178 |
| Yield 2022 |
1.54% | Yield 2023 |
-
| Free-Float | 68.59% |
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| 1 day | -3.74% | ||
| 1 week | +9.32% | ||
| Current month | +8.64% | ||
| 1 month | +8.64% | ||
| 3 months | -11.48% | ||
| 6 months | +27.85% | ||
| Current year | -24.41% |
1 week
9 680.00
11 130.00
1 month
8 850.0011 130.00
Current year
8 850.0014 850.00
1 year
6 210.0015 020.00
3 years
4 430.0015 650.00
5 years
1 980.0015 650.00
10 years
1 835.0019 150.00
| Managers | Title | Age | Since |
|---|---|---|---|
Seung-Eun Yang
CEO | Chief Executive Officer | 67 | - |
Seong-Yeop Wi
CTO | Chief Tech/Sci/R&D Officer | 63 | - |
Chan-Gwan Jeong
BRD | Director/Board Member | 52 | 03/16/03 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Seung-Eun Yang
CEO | Chief Executive Officer | 67 | - |
Seong-Yeop Wi
CTO | Chief Tech/Sci/R&D Officer | 63 | - |
Hyung-Gyu Lim
BRD | Director/Board Member | 55 | - |
| Date | Price | Change | Volume |
|---|---|---|---|
| 02/24/02 | 10,340 | -2.08% | 82,481 |
| 30/24/30 | 10,560 | -3.74% | 120,332 |
| 29/24/29 | 10,970 | +2.52% | 169,621 |
| 26/24/26 | 10,700 | +6.26% | 201,034 |
| 25/24/25 | 10,070 | +1.21% | 70,113 |
End-of-day quote Korea S.E., April 30, 2024
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Micro Contact Solution Co., Ltd. is a Korea-based company mainly engaged in the manufacture of integrated circuit (IC) sockets. The Companyâs products portfolio consists of ball grid array (BGA) type burn-in sockets, module sockets including surface mount technology (SMT) type and double inline package (DIP) type, test sockets including handler sockets, bottle cap type sockets and clamshell type sockets, land grid array (LGA) type sockets, discrete sockets, thin and small outline package (TSOP) type sockets, as well as others including connectors. Its products are used for semiconductor testing under the brand name MCS. The Company distributes its products within domestic market and to overseas markets.
Calendar
13/05/2024
- Q1 2024 Earnings Release (Projected)
| 1st Jan change | Capi. | |
|---|---|---|
| -24.41% | 62.72M | |
| +17.33% | 91.83B | |
| +9.42% | 23.85B | |
| +8.17% | 17.96B | |
| -9.26% | 4.39B | |
| -3.87% | 3.63B | |
| +12.84% | 3.58B | |
| -22.74% | 2.54B | |
| -7.72% | 1.09B | |
| -0.95% | 1.07B |
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