FECON Corporation announced a BOD resolution of a First bond private placement in 2023 as follows: Bond code: FCNH2325001, Bond type: non-convertible bond, secured and without warrant, Par, value: VND 100,000,000/bond, Issue volume: 1,500 bonds, Issue value: VND 150,000,000,000, Issue date: October 31, 2023, Term: 18 months, Interest rate: 11%/year, Issue price: 100% par value, Interest payment term: once every 3 months.
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30/04 | FECON Corporation Reports Earnings Results for the First Quarter Ended March 31, 2024 | CI |
07/02 | FECON Corporation Announces Cash Dividend for the Year 2022 | CI |
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