Valuation: Darbond Technology Co., Ltd

Market Cap 1.13TCr 166.65Cr 145.64Cr 134.63Cr 124.38Cr 234.24Cr 16TCr 238.48Cr 1.61TCr 629.93Cr 7.84TCr 625.98Cr 612.15Cr 27TCr P/E 2024
53.3x
P/E 2025 63.5x
Enterprise Value 1.06TCr 157.15Cr 137.33Cr 126.96Cr 117.29Cr 220.88Cr 15TCr 224.88Cr 1.51TCr 594.01Cr 7.39TCr 590.29Cr 577.24Cr 25TCr EV / Sales 2024
3.43x
EV / Sales 2025 3.97x
Free-Float
57.36%
Yield 2024
0.68%
Yield 2025 0.52%
1 day+0.37%
1 week-13.16%
Current month-12.53%
1 month-5.18%
3 months+24.52%
6 months+59.58%
Current year+66.42%
1 week 75.07
Extreme 75.07
105.25
1 month 75.07
Extreme 75.07
107.28
Current year 48.72
Extreme 48.72
107.28
1 year 39.88
Extreme 39.88
107.28
3 years 23.23
Extreme 23.23
107.28
5 years 23.23
Extreme 23.23
107.28
10 years 23.23
Extreme 23.23
107.28
Manager TitleAgeSince
Chief Executive Officer 68 01/05/2010
Director of Finance/CFO 47 11/12/2020
Corporate Officer/Principal - 01/01/2003
Director TitleAgeSince
Chairman 59 01/10/2016
Director/Board Member 68 01/05/2010
Director/Board Member 63 23/01/2003
Date Insider Type Main position Quantity % Market Cap.
06/07Sell -8,000 0.0099%
02/07Sell -6,000 0.0074%
01/07Sell

Chief Technology Officer

-12,500 0.0155%
Change 5-day change 1-year change 3-year change Capi.($)
+0.37%-13.16%+99.80%+20.08% 165.84Cr
-2.01%-3.33%+7.69%+2.21% 3.32TCr
+5.98%-0.30%+124.44%+133.70% 387.94Cr
+1.59%-3.92%+182.73%+98.63% 313.81Cr
-0.07%-2.69%-10.07%-20.74% 301.53Cr
+6.43%-12.46%+167.65%+209.00% 286.01Cr
+3.37%+4.81%+127.43%+195.53% 255.42Cr
+2.18%-1.66% - - 129.44Cr
-0.74%-6.27%+9.25%+105.81% 127.02Cr
-4.63%-6.76%+54.78%+127.07% 121.59Cr
Average +1.25%-6.60%+84.86%+96.81% 540.96Cr
Weighted average by Cap. -0.28%-4.82%+44.13%+42.77%

Financials

2024 2025
Net sales 116.68Cr 17Cr 15Cr 14Cr 13Cr 24Cr 1.65TCr 25Cr 165.96Cr 65Cr 810.25Cr 65Cr 63Cr 2.79TCr 154.72Cr 23Cr 20Cr 18Cr 17Cr 32Cr 2.19TCr 33Cr 220.08Cr 86Cr 1.07TCr 86Cr 84Cr 3.7TCr
Net income 9.74Cr 1.44Cr 1.26Cr 1.16Cr 1.07Cr 2.02Cr 138.17Cr 2.06Cr 14Cr 5.44Cr 68Cr 5.4Cr 5.28Cr 232.97Cr 11Cr 1.59Cr 1.39Cr 1.28Cr 1.19Cr 2.23Cr 152.61Cr 2.27Cr 15Cr 6.01Cr 75Cr 5.97Cr 5.84Cr 257.31Cr
Net Debt -117.19Cr -17Cr -15Cr -14Cr -13Cr -24Cr -1.66TCr -25Cr -166.7Cr -65Cr -813.84Cr -65Cr -64Cr -2.8TCr -64Cr -9.5Cr -8.3Cr -7.68Cr -7.09Cr -13Cr -912.78Cr -14Cr -92Cr -36Cr -446.96Cr -36Cr -35Cr -1.54TCr
Logo Darbond Technology Co., Ltd
Darbond Technology Co Ltd is a China-based company mainly engaged in the research, development and industrialization of electronic packaging materials. The products include integrated circuit packaging materials, smart terminal packaging materials, new energy application materials and equipment application materials. Integrated circuit packaging materials mainly include wafer ultraviolet (UV) films, die-bonding materials and flip-chip materials. Smart terminal packaging materials mainly include electronic packaging materials, electromagnetic interference (EMI) shielding materials and board-level packaging materials. New energy packaging materials mainly include two-component polyurethane structural adhesives, UV insulating coatings, tapes and photovoltaic stacked materials. Equipment application materials mainly include one-component epoxy structural adhesives, thread-locking anaerobic adhesives and water-based two-component epoxy structural adhesives.
Employees
980
Date Price Change Volume
14/26/14 CN¥80.30 +0.37% 72,47,709
13/26/13 CN¥80.00 -9.60% 87,37,875
10/26/10 CN¥88.50 -9.80% 1,24,87,754
09/26/09 CN¥98.11 +6.13% 93,53,551
08/26/08 CN¥92.44 -0.03% 88,89,174

Annual profits - Rate of surprise

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