Valuation: CHPMS TCHNLGS

Market Cap 7.63TCr 237.41Cr 207.76Cr 191.47Cr 177.47Cr 336.89Cr 23TCr 342.32Cr 2.3TCr 892.82Cr 11TCr 891.3Cr 872Cr 38TCr P/E 2026 *
25.9x
P/E 2027 * 18.3x
Enterprise Value 7.96TCr 247.64Cr 216.71Cr 199.72Cr 185.12Cr 351.41Cr 24TCr 357.08Cr 2.39TCr 931.31Cr 12TCr 929.73Cr 909.59Cr 40TCr EV / Sales 2026 *
2.59x
EV / Sales 2027 * 2.31x
Free-Float
78.37%
Yield 2026 *
1.13%
Yield 2027 * 1.83%
Manager TitleAgeSince
Director of Finance/CFO 54 01/10/2017
President 67 17/07/1997
Corporate Officer/Principal 60 17/04/2007
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 67 28/06/2007
Director/Board Member 64 03/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
-7.28%-12.29%+124.81%+135.76% 72TCr
-6.87%-24.74%+232.31%+427.83% 44TCr
-3.94%-7.00%+155.64%+239.21% 20TCr
-4.12%+3.83%+342.86%+500.00% 9.3TCr
+0.59%-11.72%+1,304.86%+2,021.00% 2.94TCr
-6.36%-10.47%+136.13%+107.98% 2.6TCr
-6.95%-25.35%+62.75%+27.63% 2.21TCr
-4.31%+1.94%+183.77%+330.48% 2.08TCr
-6.51%-24.24%+204.71%+133.74% 1.73TCr
Average -4.72%-7.55%+305.31%+435.96% 17.38TCr
Weighted average by Cap. -6.25%-5.15%+195.02%+288.58%

Financials

2026 *2027 *
Net sales 3.07TCr 95Cr 84Cr 77Cr 71Cr 135.5Cr 9.06TCr 137.68Cr 923.39Cr 359.09Cr 4.47TCr 358.48Cr 350.72Cr 15TCr 3.33TCr 103.68Cr 91Cr 84Cr 77Cr 147.12Cr 9.84TCr 149.49Cr 1TCr 389.89Cr 4.86TCr 389.23Cr 380.8Cr 17TCr
Net income 301.36Cr 9.38Cr 8.21Cr 7.56Cr 7.01Cr 13Cr 889.96Cr 14Cr 91Cr 35Cr 439.22Cr 35Cr 34Cr 1.52TCr 426.3Cr 13Cr 12Cr 11Cr 9.92Cr 19Cr 1.26TCr 19Cr 128.28Cr 50Cr 621.31Cr 50Cr 49Cr 2.15TCr
Net Debt 328.95Cr 10Cr 8.96Cr 8.25Cr 7.65Cr 15Cr 971.44Cr 15Cr 99Cr 38Cr 479.43Cr 38Cr 38Cr 1.66TCr 80Cr 2.48Cr 2.17Cr 2Cr 1.85Cr 3.52Cr 235.35Cr 3.58Cr 24Cr 9.33Cr 116.15Cr 9.31Cr 9.11Cr 401.47Cr
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
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Global
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ESG MSCI
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