Valuation: CHPMS TCHNLGS

Market Cap 6.14TCr 192.74Cr 165.18Cr 154.52Cr 141.27Cr 266.59Cr 18TCr 269.43Cr 1.83TCr 710.99Cr 9.27TCr 723.67Cr 708Cr 31TCr P/E 2026 *
18.9x
P/E 2027 * 13.2x
Enterprise Value 6.63TCr 208.01Cr 178.26Cr 166.77Cr 152.47Cr 287.72Cr 20TCr 290.78Cr 1.97TCr 767.32Cr 10TCr 781.01Cr 764.1Cr 33TCr EV / Sales 2026 *
2.19x
EV / Sales 2027 * 1.97x
Free-Float
77.34%
Yield 2026 *
2.5%
Yield 2027 * 4.02%
Manager TitleAgeSince
Chief Executive Officer 67 17/07/1997
Director of Finance/CFO 54 01/10/2017
Chief Operating Officer - 06/03/2012
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 69 28/06/2007
Director/Board Member 70 17/06/2013
Change 5-day change 1-year change 3-year change Capi.($)
-1.08%-5.68%+130.55%+138.22% 68TCr
-1.22%-6.68%+209.92%+357.42% 39TCr
+1.58%-6.73%+174.45%+161.81% 16TCr
+0.85%-3.90%+312.54%+440.64% 8.11TCr
-3.77%-14.53%+57.53%+39.55% 2.2TCr
-0.88%-10.33%+116.95%+62.44% 1.98TCr
+1.39%-7.88%+131.21%+266.93% 1.54TCr
-3.55%-14.71%+160.75%+141.02% 1.44TCr
-4.70%-18.80%+98.84%+80.28% 1.25TCr
Average -1.23%-7.83%+154.75%+187.59% 15.43TCr
Weighted average by Cap. -0.76%-5.41%+167.23%+218.84%

Financials

2026 *2027 *
Net sales 3.03TCr 95Cr 82Cr 76Cr 70Cr 131.57Cr 9.11TCr 132.97Cr 902.38Cr 350.88Cr 4.57TCr 357.14Cr 349.41Cr 15TCr 3.53TCr 110.72Cr 95Cr 89Cr 81Cr 153.15Cr 11TCr 154.78Cr 1.05TCr 408.45Cr 5.32TCr 415.74Cr 406.73Cr 18TCr
Net income 327.98Cr 10Cr 8.82Cr 8.26Cr 7.55Cr 14Cr 985.99Cr 14Cr 98Cr 38Cr 495.11Cr 39Cr 38Cr 1.64TCr 469.69Cr 15Cr 13Cr 12Cr 11Cr 20Cr 1.41TCr 21Cr 139.9Cr 54Cr 709.03Cr 55Cr 54Cr 2.35TCr
Net Debt 486.43Cr 15Cr 13Cr 12Cr 11Cr 21Cr 1.46TCr 21Cr 144.89Cr 56Cr 734.3Cr 57Cr 56Cr 2.43TCr 801.78Cr 25Cr 22Cr 20Cr 18Cr 35Cr 2.41TCr 35Cr 238.81Cr 93Cr 1.21TCr 95Cr 92Cr 4TCr
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
-
Trader
Investor
-
Global
-
Quality
-
ESG MSCI
-