Valuation: CHPMS TCHNLGS

Market Cap 6.29TCr 194.61Cr 171.09Cr 159.26Cr 146.26Cr 274.64Cr 19TCr 278.26Cr 1.89TCr 739.34Cr 9.22TCr 730.56Cr 714.82Cr 32TCr P/E 2026 *
20.9x
P/E 2027 * 14.2x
Enterprise Value 6.64TCr 205.24Cr 180.43Cr 167.95Cr 154.24Cr 289.63Cr 20TCr 293.45Cr 2TCr 779.7Cr 9.72TCr 770.45Cr 753.84Cr 34TCr EV / Sales 2026 *
2.2x
EV / Sales 2027 * 1.96x
Free-Float
77.34%
Yield 2026 *
1.39%
Yield 2027 * 2.31%
Manager TitleAgeSince
Director of Finance/CFO 54 01/10/2017
President 67 17/07/1997
Corporate Officer/Principal 60 17/04/2007
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 67 28/06/2007
Director/Board Member 64 03/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
-0.94%-11.06%+125.56%+117.03% 62TCr
-4.46%-4.94%+200.75%+315.43% 36TCr
-10.96%-16.00%+104.61%+167.43% 17TCr
-0.82%+1.84%+296.09%+433.33% 8.25TCr
-14.05%-12.26%+131.18%+75.49% 2.39TCr
-2.15%-5.55%+37.58%+18.42% 1.93TCr
-10.82%-16.52%+157.03%+258.41% 1.84TCr
-6.54%-2.96%+186.91%+108.91% 1.5TCr
-3.77%-5.82%+163.81%+123.64% 1.3TCr
Average -5.63%-2.81%+155.95%+179.79% 14.84TCr
Weighted average by Cap. -2.20%-4.31%+154.21%+197.06%

Financials

2026 *2027 *
Net sales 3.02TCr 93Cr 82Cr 76Cr 70Cr 131.9Cr 8.96TCr 133.64Cr 909.18Cr 355.09Cr 4.43TCr 350.88Cr 343.31Cr 15TCr 3.47TCr 107.38Cr 94Cr 88Cr 81Cr 151.53Cr 10TCr 153.53Cr 1.04TCr 407.93Cr 5.08TCr 403.09Cr 394.4Cr 18TCr
Net income 305.26Cr 9.44Cr 8.3Cr 7.73Cr 7.09Cr 13Cr 905.34Cr 13Cr 92Cr 36Cr 447.04Cr 35Cr 35Cr 1.55TCr 450.13Cr 14Cr 12Cr 11Cr 10Cr 20Cr 1.34TCr 20Cr 135.41Cr 53Cr 659.2Cr 52Cr 51Cr 2.28TCr
Net Debt 343.57Cr 11Cr 9.34Cr 8.69Cr 7.99Cr 15Cr 1.02TCr 15Cr 103.35Cr 40Cr 503.14Cr 40Cr 39Cr 1.74TCr 524.2Cr 16Cr 14Cr 13Cr 12Cr 23Cr 1.55TCr 23Cr 157.69Cr 62Cr 767.67Cr 61Cr 60Cr 2.65TCr
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
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Global
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Quality
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ESG MSCI
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