Valuation: CHPMS TCHNLGS

Market Cap 5.67TCr 175.13Cr 153.69Cr 143.12Cr 131.64Cr 246.77Cr 17TCr 251Cr 1.7TCr 664.6Cr 8.3TCr 657.48Cr 643.27Cr 29TCr P/E 2026 *
18.8x
P/E 2027 * 12.8x
Enterprise Value 6.01TCr 185.74Cr 163.01Cr 151.79Cr 139.62Cr 261.72Cr 18TCr 266.21Cr 1.8TCr 704.88Cr 8.8TCr 697.32Cr 682.25Cr 30TCr EV / Sales 2026 *
1.99x
EV / Sales 2027 * 1.78x
Free-Float
77.34%
Yield 2026 *
1.54%
Yield 2027 * 2.56%
Manager TitleAgeSince
Director of Finance/CFO 54 01/10/2017
President 67 17/07/1997
Corporate Officer/Principal 60 17/04/2007
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 67 28/06/2007
Director/Board Member 64 03/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
-0.63%-12.91%+122.22%+112.27% 61TCr
-7.54%-16.27%+173.38%+273.80% 34TCr
-10.59%-24.20%+85.19%+135.35% 16TCr
-8.88%-12.48%+258.58%+371.49% 7.51TCr
-8.31%-20.14%+131.18%+59.86% 2.05TCr
-6.50%-15.70%+28.43%+8.89% 1.8TCr
-17.25%-28.91%+109.46%+205.87% 1.64TCr
-7.79%-19.11%+137.52%+98.01% 1.2TCr
-24.74%-31.53%+115.21%+54.25% 1.13TCr
Average -9.01%-11.75%+129.02%+146.64% 13.93TCr
Weighted average by Cap. -3.36%-11.19%+138.28%+172.33%

Financials

2026 *2027 *
Net sales 3.02TCr 93Cr 82Cr 76Cr 70Cr 131.54Cr 8.92TCr 133.8Cr 905.11Cr 354.27Cr 4.42TCr 350.47Cr 342.9Cr 15TCr 3.47TCr 107.25Cr 94Cr 88Cr 81Cr 151.11Cr 10TCr 153.71Cr 1.04TCr 406.99Cr 5.08TCr 402.62Cr 393.93Cr 18TCr
Net income 305.26Cr 9.43Cr 8.27Cr 7.71Cr 7.09Cr 13Cr 900.8Cr 14Cr 91Cr 36Cr 446.74Cr 35Cr 35Cr 1.54TCr 450.13Cr 14Cr 12Cr 11Cr 10Cr 20Cr 1.33TCr 20Cr 134.8Cr 53Cr 658.75Cr 52Cr 51Cr 2.28TCr
Net Debt 343.57Cr 11Cr 9.31Cr 8.67Cr 7.98Cr 15Cr 1.01TCr 15Cr 102.89Cr 40Cr 502.8Cr 40Cr 39Cr 1.74TCr 524.2Cr 16Cr 14Cr 13Cr 12Cr 23Cr 1.55TCr 23Cr 156.98Cr 61Cr 767.15Cr 61Cr 59Cr 2.65TCr
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
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Global
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ESG MSCI
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