Valuation: CHPMS TCHNLGS

Market Cap 6.36TCr 196.47Cr 172.56Cr 160.48Cr 147.26Cr 276.69Cr 19TCr 280.95Cr 1.91TCr 744.51Cr 9.3TCr 737.55Cr 721.66Cr 32TCr P/E 2026 *
21.1x
P/E 2027 * 14.4x
Enterprise Value 6.7TCr 207.09Cr 181.89Cr 169.15Cr 155.22Cr 291.65Cr 20TCr 296.14Cr 2.01TCr 784.75Cr 9.8TCr 777.42Cr 760.67Cr 34TCr EV / Sales 2026 *
2.22x
EV / Sales 2027 * 1.98x
Free-Float
77.34%
Yield 2026 *
1.37%
Yield 2027 * 2.29%
Manager TitleAgeSince
Director of Finance/CFO 54 01/10/2017
President 67 17/07/1997
Corporate Officer/Principal 60 17/04/2007
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 67 28/06/2007
Director/Board Member 64 03/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
+1.72%+4.51%+152.97%+143.47% 68TCr
-4.56%-2.58%+214.78%+375.13% 38TCr
+0.22%-5.66%+129.78%+207.84% 17TCr
-5.55%-0.16%+299.35%+440.09% 8.32TCr
+0.90%+2.09%+168.97%+106.05% 2.36TCr
-4.55%-6.91%+40.61%+23.73% 1.97TCr
+0.28%-6.39%+188.21%+305.61% 1.83TCr
-0.57%+3.21%+206.99%+129.30% 1.61TCr
-6.40%-2.58%+174.16%+152.22% 1.36TCr
Average -2.05%-1.02%+175.09%+209.27% 15.71TCr
Weighted average by Cap. -0.77%-0.27%+175.39%+231.12%

Financials

2026 *2027 *
Net sales 3.02TCr 93Cr 82Cr 76Cr 70Cr 131.57Cr 9TCr 133.6Cr 906.17Cr 354.03Cr 4.42TCr 350.72Cr 343.16Cr 15TCr 3.47TCr 107.33Cr 94Cr 88Cr 80Cr 151.15Cr 10TCr 153.48Cr 1.04TCr 406.71Cr 5.08TCr 402.91Cr 394.23Cr 18TCr
Net income 305.26Cr 9.44Cr 8.29Cr 7.71Cr 7.07Cr 13Cr 908.72Cr 13Cr 92Cr 36Cr 446.76Cr 35Cr 35Cr 1.54TCr 450.13Cr 14Cr 12Cr 11Cr 10Cr 20Cr 1.34TCr 20Cr 134.96Cr 53Cr 658.78Cr 52Cr 51Cr 2.28TCr
Net Debt 343.57Cr 11Cr 9.33Cr 8.67Cr 7.96Cr 15Cr 1.02TCr 15Cr 103.01Cr 40Cr 502.82Cr 40Cr 39Cr 1.74TCr 524.2Cr 16Cr 14Cr 13Cr 12Cr 23Cr 1.56TCr 23Cr 157.17Cr 61Cr 767.18Cr 61Cr 60Cr 2.65TCr
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
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Global
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ESG MSCI
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