Valuation: CHPMS TCHNLGS

Market Cap 5.1TCr 157.48Cr 138.37Cr 129.16Cr 118.54Cr 221.89Cr 15TCr 227.36Cr 1.53TCr 598.98Cr 7.46TCr 591.25Cr 578.41Cr 26TCr P/E 2026 *
16.9x
P/E 2027 * 11.5x
Enterprise Value 5.45TCr 168.08Cr 147.69Cr 137.86Cr 126.52Cr 236.83Cr 16TCr 242.67Cr 1.63TCr 639.31Cr 7.97TCr 631.05Cr 617.36Cr 28TCr EV / Sales 2026 *
1.8x
EV / Sales 2027 * 1.62x
Free-Float
77.34%
Yield 2026 *
1.71%
Yield 2027 * 2.85%
Manager TitleAgeSince
Director of Finance/CFO 54 01/10/2017
President 67 17/07/1997
Corporate Officer/Principal 60 17/04/2007
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 67 28/06/2007
Director/Board Member 64 03/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
-1.89%-14.31%+118.65%+108.61% 61TCr
-6.40%-20.97%+155.05%+249.87% 34TCr
+3.88%-24.20%+85.19%+139.12% 16TCr
-9.93%-21.17%+222.98%+324.68% 7.51TCr
+2.39%-20.14%+131.18%+60.91% 2.05TCr
-9.36%-22.16%+15.25%-1.38% 1.8TCr
+2.94%-28.91%+109.46%+196.59% 1.64TCr
-9.75%-26.06%+116.32%+78.71% 1.2TCr
-6.48%-36.20%+70.37%+44.26% 1.13TCr
Average -7.75%-24.02%+113.83%+133.48% 13.93TCr
Weighted average by Cap. -2.42%-18.35%+128.69%+161.25%

Financials

2026 *2027 *
Net sales 3.02TCr 93Cr 82Cr 77Cr 70Cr 131.42Cr 8.93TCr 134.66Cr 907.15Cr 354.76Cr 4.42TCr 350.19Cr 342.58Cr 15TCr 3.47TCr 107.15Cr 94Cr 88Cr 81Cr 150.98Cr 10TCr 154.7Cr 1.04TCr 407.56Cr 5.08TCr 402.3Cr 393.56Cr 18TCr
Net income 305.26Cr 9.42Cr 8.28Cr 7.73Cr 7.09Cr 13Cr 902.33Cr 14Cr 92Cr 36Cr 446.51Cr 35Cr 35Cr 1.54TCr 450.13Cr 14Cr 12Cr 11Cr 10Cr 20Cr 1.33TCr 20Cr 135.11Cr 53Cr 658.41Cr 52Cr 51Cr 2.28TCr
Net Debt 343.57Cr 11Cr 9.32Cr 8.7Cr 7.98Cr 15Cr 1.02TCr 15Cr 103.12Cr 40Cr 502.54Cr 40Cr 39Cr 1.74TCr 524.2Cr 16Cr 14Cr 13Cr 12Cr 23Cr 1.55TCr 23Cr 157.34Cr 62Cr 766.76Cr 61Cr 59Cr 2.65TCr
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
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Global
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ESG MSCI
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