Valuation: ChipMOS TECHNOLOGIES INC.

Market Cap 7.35TCr 229.98Cr 201.05Cr 184.76Cr 172.22Cr 326.65Cr 22TCr 331.6Cr 2.22TCr 862.27Cr 11TCr 863.24Cr 844.7Cr 37TCr P/E 2026 *
24.9x
P/E 2027 * 17.7x
Enterprise Value 7.68TCr 240.27Cr 210.04Cr 193.03Cr 179.93Cr 341.27Cr 23TCr 346.44Cr 2.32TCr 900.87Cr 11TCr 901.88Cr 882.51Cr 39TCr EV / Sales 2026 *
2.5x
EV / Sales 2027 * 2.23x
Free-Float
78.37%
Yield 2026 *
1.17%
Yield 2027 * 1.9%
Manager TitleAgeSince
Director of Finance/CFO 54 01/10/2017
President 67 17/07/1997
Corporate Officer/Principal 60 17/04/2007
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 67 28/06/2007
Director/Board Member 64 03/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 229.98Cr
+3.59%+3.56%+147.86%+147.90% 72TCr
-10.19%-7.30%+255.64%+459.05% 44TCr
+1.12%-0.78%+173.25%+247.74% 21TCr
-6.19%+7.91%+363.95%+514.41% 9.36TCr
-2.44%-12.20%+1,388.62%+2,163.17% 3.14TCr
-0.06%-3.29%+155.33%+120.07% 2.65TCr
-11.22%-9.15%+69.28%+36.69% 2.24TCr
-0.92%+13.51%+221.05%+367.28% 2.22TCr
-12.93%-11.52%+213.32%+144.73% 1.73TCr
Average -3.78%-3.55%+332.03%+466.78% 17.54TCr
Weighted average by Cap. -1.75%-1.75%+219.44%+310.41%

Financials

2026 *2027 *
Net sales 3.07TCr 96Cr 84Cr 77Cr 72Cr 136.38Cr 9.14TCr 138.45Cr 926.1Cr 360.02Cr 4.49TCr 360.42Cr 352.68Cr 15TCr 3.33TCr 104.26Cr 91Cr 84Cr 78Cr 148.08Cr 9.93TCr 150.33Cr 1.01TCr 390.9Cr 4.88TCr 391.33Cr 382.93Cr 17TCr
Net income 301.36Cr 9.43Cr 8.24Cr 7.58Cr 7.06Cr 13Cr 897.83Cr 14Cr 91Cr 35Cr 441.33Cr 35Cr 35Cr 1.52TCr 426.3Cr 13Cr 12Cr 11Cr 9.99Cr 19Cr 1.27TCr 19Cr 128.65Cr 50Cr 624.3Cr 50Cr 49Cr 2.15TCr
Net Debt 328.95Cr 10Cr 9Cr 8.27Cr 7.71Cr 15Cr 980.02Cr 15Cr 99Cr 39Cr 481.73Cr 39Cr 38Cr 1.66TCr 80Cr 2.49Cr 2.18Cr 2Cr 1.87Cr 3.54Cr 237.43Cr 3.6Cr 24Cr 9.35Cr 116.71Cr 9.36Cr 9.16Cr 402.18Cr
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
Trader
Investor
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Global
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Quality
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ESG MSCI
A