Technoprobe S.p.A.

Via Cavalieri di Vittorio Veneto, 2

23870, Cernusco Lombardone (LC) - Italy www.technoprobe.com

PRESS RELEASE

CALENDAR OF CORPORATE EVENTS FOR THE FINANCIAL YEAR 2023

Cernusco Lombardone (LC), 27 January 2023 - The Board of Directors of Technoprobe S.p.A., a leading company in the design and production of probe cards (the "Company" or "Technoprobe") listed on Euronext Growth Milan, approved today the calendar of corporate events for the financial year 2023.

27 February 2023

Board of Directors meeting for the approval of the draft financial

statements and the consolidated financial statements as at 31

December 2022 fully audited

7 April 2023

Shareholders' Meeting for the approval of the financial statements

for the year ended 31 December 2022 and presentation of the

consolidated financial statements for the year ended 31 December

2022

15 May 2023

Board of Directors' meeting to review turnover data, EBITDA and net

financial position figures as at March 31, 2023 (unaudited)

9 August 2023

Board of Directors meeting for the approval of the consolidated half-

year financial report as at 30 June 2022 subject to a limited audit

14 November 2023

Board of Directors' meeting to review turnover data, EBITDA and net

financial position figures as at September 30, 2023 (unaudited)

Following each Board of Directors' meeting to approve the periodic financial statements, a press release will be published and there will be a conference call with the financial community; dates and timing will be duly announced as soon as they are scheduled.

Technoprobe will promptly inform you of any changes to the published dates.

The calendar of corporate events for the financial year 2023 is available on Technoprobe's website, in the Investor Relations section www.technoprobe.com/investors/financial-calendar.

The Company also informs that, today, the Board of Directors also confirmed its intention to start the process of listing the Company's shares on Euronext Milan which is expected to be finalized by the end of 2023.

Technoprobe S.p.A. - VAT No. and Tax Code 02272540135 - Share Capital € 6,010,000 - Economic and Administrative Index no. 283619 All rights reserved. The COPYRIGHT of this document is property of TECHNOPROBE S.p.A. No part of this document may be copied, reprinted or reproduced in any material form, whether wholly or in part, without a written consent. The contents or methods or techniques contained herein are CONFIDENTIAL, therefore must not be disclosed to any other person or company or entity.

Technoprobe S.p.A.

Via Cavalieri di Vittorio Veneto, 2

23870, Cernusco Lombardone (LC) - Italy www.technoprobe.com

***

This press release is available on Technoprobe's website www.technoprobe.com, in the Investor Relations section.

Contacts

Technoprobe S.p.A.

Technoprobe S.p.A.

Investor Relator

Communication & Marketing Manager

Ines Di Terlizzi

Paolo Cavallotti

Email: ir@technoprobe.com

Email: paolo.cavallotti@technoprobe.com

Technoprobe S.p.A. - Comin & Partners

Tommaso Accomanno

Email: tommaso.accomanno@cominandpartners.com

Mob. +39 340 770 1750

Euronext Growth Advisor and Specialist

Mediobanca - Banca di Credito Finanziario S.p.A.

Piazzetta Enrico Cuccia No. 1 Milan

Email: ega@mediobanca.com

Tel: +39 02 88291

Technoprobe Group

Technoprobe is a leading company in the field of semiconductors and microelectronics. Established in 1996 by the entrepreneurial spirit of its founder Giuseppe Crippa, Technoprobe specialises in the design and manufacture of Probe Cards, i.e. electro-mechanical interfaces used for the functional testing of chips. Its market segment is the testing of non-memory or SOC (system on chip) semiconductors. The Group is the only Probe Card manufacturer in Italy and a world leader in terms of volume and turnover. It has partnerships and collaborations with some of the world's largest microelectronics, IT and digital companies. Probe cards are hi-tech devices that are custom- made for each chip and allow the function of chips to be tested during the manufacturing process. These technologically-advanced designs and solutions are essential for ensuring the proper functioning and reliability of devices that play a crucial role in industries such as Information Technology, 5G, Internet of Things, home automation, automotive, aerospace, etc. As a result, Technoprobe is a critical link in the supply chain for the manufacture of chips, which are at the heart of today's technological world. Technoprobe is a rapidly expanding hub of technological research and innovation with approximately 2700 employees (1700 of them located in Italy), three research centres and more than 600 certified patents. Technoprobe has 14 locations worldwide. The Group's Italian headquarters are in Cernusco Lombardone (LC), a municipality on the outskirts of Milan where there is also a production plant that covers an area of about 18,000 sqm. The Group has two additional production plants in Italy: one in Agrate (MB) covering about 3,000 sqm, and one in Osnago (LC) covering about 5,000 sqm. Also in Italy a Design Center was opened in Sicily, in Catania, in 2022. The Group also has 10 other locations spread across Europe (France and Germany), Asia (Taiwan, South Korea, China, Japan, Philippines and Singapore) and the United States (two locations in California). On 15 February 2022, Technoprobe was listed on the Euronext Growth Milano market.

For more information, visit their website: www.technoprobe.com

Technoprobe S.p.A. - VAT No. and Tax Code 02272540135 - Share Capital € 6,010,000 - Economic and Administrative Index no. 283619 All rights reserved. The COPYRIGHT of this document is property of TECHNOPROBE S.p.A. No part of this document may be copied, reprinted or reproduced in any material form, whether wholly or in part, without a written consent. The contents or methods or techniques contained herein are CONFIDENTIAL, therefore must not be disclosed to any other person or company or entity.

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Technoprobe S.p.A. published this content on 27 January 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 27 January 2023 17:29:07 UTC.