Today's Information |
Provided by: Taiwan Semiconductor Manufacturing Co., Ltd. | |||||
SEQ_NO | 10 | Date of announcement | 2022/02/15 | Time of announcement | 20:56:04 |
Subject | TSMC Board of Directors approved capital appropriations - machinery equipment, real estate and capitalized leased assets | ||||
Date of events | 2022/02/15 | To which item it meets | paragraph 20 | ||
Statement | 1.Name and nature of the underlying asset (e.g., land located at Sublot XX, Lot XX, North District, Taichung City): TSMC Board of Directors approved the following capital appropriations: (1) Machinery equipment for advanced technology capacity; (2) Machinery equipment for advanced packaging, mature and specialty technology capacity; (3) Machinery equipment for R&D capital investments and sustaining capital expenditures; (4) Real estate and capitalized leased assets. 2.Date of occurrence of the event:2022/02/15 3.Transaction unit amount (e.g.XX square meters, equivalent to XX ping), unit price, and total transaction price: (1) Machinery equipment for advanced technology capacity: NT$259.8 billion; (2) Machinery equipment for advanced packaging, mature and specialty technology capacity: NT$41.9 billion; (3) Machinery equipment for R&D capital investments and sustaining capital expenditures: NT$40.0 billion; (4) Real estate and capitalized leased assets: NT$213.3 billion. 4.Trading counterparty and its relationship with the Company (if the trading counterparty is a natural person and furthermore is not a related party of the Company, the name of the trading counterparty is not required to be disclosed): Expected Counterparties (actual counterparties may differ in the final purchase orders): (1) Machinery equipment for advanced technology capacity: 64 counterparties, including Advanced Micro Fabrication Equipment; Applied Materials South East Asia Pte. Ltd.; ASM America, Inc; ASML Hong Kong Ltd.; Canon Inc.; Daifuku Co., Ltd.; EBARA Corporation; Hitachi High-Technologies; IMS Nanofabrication AG; KLA-Tencor Corp.; Kokusai Electric Corporation; Lam Research International Sarl; Lasertec Corporation; Murata Machinery, Ltd. Taiwan Project Office; SCREEN Semiconductor Solutions Co., Ltd.; Tokyo Electron Ltd., etc. Relationship: None. (2) Machinery equipment for advanced packaging, mature and specialty technology capacity: 101 counterparties, including Applied Materials South East Asia Pte. Ltd.; ASML Hong Kong Ltd.; EBARA Corporation; KLA-Tencor Corp.; Lam Research International Sarl; SCREEN Semiconductor Solutions Co., Ltd.; Tokyo Electron Ltd., etc. Relationship: None. (3) Machinery equipment for R&D capital investments and sustaining capital expenditures: 74 counterparties, including Applied Materials South East Asia Pte. Ltd.; ASML Hong Kong Ltd.; KLA-Tencor Corp.; Lam Research International Sarl, etc. Relationship: None. (4) Real estate and capitalized leased assets: 122 counterparties, including ABB Ltd.; Accudevice Co., Ltd.; Addtron Technology (Japan), Inc.; Aegis Technology Co.; Air Liquid Japan G.K.; Air Liquide Far Eastern Ltd.; Air Water Plant Engineering Co., Ltd.; Allis Electric Co., Ltd.; Am-Power Machine International Enterprise Co., Ltd.; Atlas Copco Taiwan Ltd.; Atlas Technology Corp.; Capital Machinery Limited; Chen Yuan International Co., Ltd.; Chenfull International Co., Ltd.; Cheng Deh Fire Protection Industrial Corp.; Chien Kuo Construction Co., Ltd.; China Steel Structure Co., Ltd.; Chun Yuan Steel Industry Co., Ltd.; Chung-Lin General Contractors, Ltd.; Chungwa Telecom Japan Co.,Ltd.; Cica-Huntek Chemical Technology Taiwan Co., Ltd.; Confederate Technology Co., Ltd.; Da-Cin Construction Co., Ltd.; Desiccant Technology Corporation; Eaton Electric Japan; Evergreen Steel Corporation; Exyte Taiwan Co., Ltd.; Fortune Electric Co., Ltd.; Fu Tsu Construction Co., Ltd.; Fuji Electric Co., Ltd; Fuji Furukawa E&C Co., Ltd; Green Partners Industry Co., Ltd; Hantech Engineering Co., Ltd.; Hitachi Energy Ltd.; Hsieh Kun Co., Ltd.; Hueng Luei Process Industry Co., Ltd.; Ingersoll-Rand Southeast Asia (Pte) Ltd. Taiwan Branch (Singapore); J.C. Yang Architect and Associates; Japan Material Co., Ltd.; JG Environmental Technology Co., Ltd.; Jienshian Information Engineering Co., Ltd.; JJmr-Clean-Air Solution Tech.Services Co., Ltd.; Johnson Controls York Taiwan Co, Ltd.; Jusun Instruments Co., Ltd.; Kajima Corporation; Kanto Chemical Engineering Co., Ltd.; Kao Hsin Engineering Co., Ltd.; Kedge Construction Co., Ltd.; Kinetics Technology Corporation; Koei International Corp.; Kuken Kogyo Co., Ltd.; Kurita Water Industries Ltd., Taiwan; Kyudenko Corporation; L&K Engineering Co., Ltd.; Lead-Fu Industrials Corporation; Lee Ming Construction Co., Ltd.; Lumax International Corp., Ltd.; Mandartech Interiors Inc.; Marketech International Corp.; Mega Union Technology Incorporated; Mitsubishi Heavy Industries Air-Conditioning & Refrigeration Corporation; Mitsubishi Heavy Industries, Ltd.; NAGASE & CO. LTD.; NEC Facilities, Ltd.; Organo Corporation; Organo Technology Co., Ltd.; Ovivo Taiwan Co., Ltd.; Pan Asia (Engineers & Constructors) Corporation; Quicken System Integration Co., Ltd.; Ruentex Engineering & Construction Co., Ltd.; SACHEM Inc.; San Fu Chemical Co., Ltd.; Schneider Electric Taiwan Co., Ltd.; Seibu Giken Co., Ltd.; Shihlin Electric & Engineering Corporation; Shimizu Corporation; Siemens Limited; SN Tech Corporation; Solomon Technology Corporation; Sumitomo Corporation; Swift Engineering Co., Ltd.; Taikisha Ltd.; Taisei Corporation; Taiwan Gleno Enterprise Co., Ltd.; Taiwan Obayashi Corporation; Taiwan Puritic Corp.; Taiyo Nippon Sanso Corporation; TASA Construction Corporation; Techgo Industrial Co., Ltd.; Toshiba Mitsubishi-Electric Industrial Systems Corporation; Toyoko Kagaku Co., Ltd.; Trane Taiwan Distribution Limited; Trusval Technology Co., Ltd.; Tung Kang Steel Structure Corp.; Uangyih-Tech Industrial Co., Ltd.; Unelectra International Corp.; United Integrated Services Co., Ltd.; Versum Materials Taiwan Co., Ltd.; Vertiv; Weltall Technology Corporation; Wholetech System Hitech Limited; Yangtech Engineering Co., Ltd.; Yankey Engineering Co., Ltd.; Ying Pao Technology Inc.; Zhao-Cheng Corp., etc. Relationship: None. 5.Where the trading counterparty is a related party, announcement shall also be made of the reason for choosing the related party as trading counterparty and the identity of the previous owner, its relationship with the Company and the trading counterparty, and the previous date and monetary amount of transfer:NA 6.Where an owner of the underlying assets within the past five years has been a related party of the Company, the announcement shall also include the date and price of acquisition and disposal by the related party, and its relationship with the Company at the time of the transaction:NA 7.Projected gain (or loss) through disposal (not applicable for acquisition of assets; those with deferral should provide a table explaining recognition):NA 8.Terms of delivery or payment (including payment period and monetary amount), restrictive covenants in the contract, and other important terms and conditions: Based on the terms in the purchase order. 9.The manner of deciding on this transaction (such as invitation to tender, price comparison, or price negotiation), the reference basis for the decision on price, and the decision-making unit: Price comparison and negotiation; Quotations offered by vendors and market price; Based on the approval of TSMC Board of Directors Meeting. 10.Name of the professional appraisal firm or company and its appraisal price:NA 11.Name of the professional appraiser:NA 12.Practice certificate number of the professional appraiser:NA 13.The appraisal report has a limited price, specific price, or special price:NA 14.An appraisal report has not yet been obtained:NA 15.Reason for an appraisal report not being obtained:NA 16.Reason for any significant discrepancy with the appraisal reports and opinion of the CPA:NA 17.Name of the CPA firm:NA 18.Name of the CPA:NA 19.Practice certificate number of the CPA:NA 20.Broker and broker's fee:NA 21.Concrete purpose or use of the acquisition or disposal: For production and operation. 22.Any dissenting opinions of directors to the present transaction:No 23.Whether the counterparty of the current transaction is a related party:No 24.Date of the board of directors resolution:NA 25.Date of ratification by supervisors or approval by the audit committee:NA 26.The transaction is to acquire a real property or right-of-use asset from a related party:No 27.The price assessed in accordance with the Article 16 of the Regulations Governing the Acquisition and Disposal of Assets by Public Companies:NA 28.Where the above assessed price is lower than the transaction price, the price assessed in accordance with the Article 17 of the same regulations:NA 29.Any other matters that need to be specified:None |
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TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 15 February 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 15 February 2022 13:06:07 UTC.