Valuation: Strasbaugh

Market Cap 1Cr 89.69L 81.97L 74.82L 1.41Cr 94Cr 1.45Cr 9.88Cr 3.94Cr 50Cr 3.75Cr 3.67Cr 158.34Cr P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 87.6L 78.57L 71.8L 65.55L 1.23Cr 82Cr 1.27Cr 8.65Cr 3.45Cr 44Cr 3.29Cr 3.22Cr 138.71Cr EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
5 years 0
Extreme 1.0E-6
0
10 years 0
Extreme 1.0E-6
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 14
+2.69%-9.14%+47.40%+114.25% 55TCr
+4.22%-14.71%+44.61%+134.74% 26TCr
+8.23%-16.17%+25.79%+212.57% 25TCr
+6.69%-12.30%+16.05%+175.26% 18TCr
-4.99%-19.64%+40.36%+568.14% 13TCr
-5.60%-13.15%+25.96%+94.74% 12TCr
-7.87%-21.11%+130.63%+348.51% 7.07TCr
-0.18%+16.97%+35.35%+194.91% 6.1TCr
0.00%+18.86%+22.42%+129.09% 3.64TCr
Average +0.32%-9.83%+43.18%+219.14% 16.56TCr
Weighted average by Cap. +2.41%-14.38%+40.76%+185.94%

Financials

2008 2009
Net sales 95.54L 85.69L 78.31L 71.49L 1.35Cr 90Cr 1.39Cr 9.44Cr 3.76Cr 48Cr 3.59Cr 3.51Cr 151.28Cr 1.29Cr 1.15Cr 1.06Cr 96.32L 1.81Cr 121.01Cr 1.87Cr 13Cr 5.07Cr 65Cr 4.83Cr 4.73Cr 203.83Cr
Net income -45.08L -40.43L -36.95L -33.73L -63.55L -42Cr -65.56L -4.45Cr -1.78Cr -23Cr -1.69Cr -1.66Cr -71Cr -7L -6L -6L -5L -10L -6.39Cr -10L -67.18L -26.79L -3.41Cr -25.52L -24.98L -11Cr
Net Debt -0.19 -0.17 -0.15 -0.14 -0.27 -17.67 -0.27 -1.86 -0.74 -9.43 -0.71 -0.69 -29.77 -1.24 -1.11 -1.02 -0.93 -1.75 -116.56 -1.8 -12.25 -4.89 -62.2 -4.65 -4.55 -196.35
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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