Valuation: Strasbaugh

Market Cap 1Cr 87.8L 80.81L 75.31L 1.42Cr 95Cr 1.45Cr 9.72Cr 3.77Cr 47Cr 3.75Cr 3.67Cr 162.41Cr P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 87.6L 76.91L 70.79L 65.97L 1.24Cr 83Cr 1.27Cr 8.51Cr 3.3Cr 41Cr 3.29Cr 3.22Cr 142.27Cr EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
5 years 0
Extreme 0
0.09
10 years 0
Extreme 0
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 14
-9.97%+10.52%+254.22%+350.33% 57TCr
+5.74%+21.46%+184.85%+297.52% 9.44TCr
-1.39%+20.63%+276.60%+340.00% 6.46TCr
-0.75%+2.46%+88.64%+155.70% 5.59TCr
-7.44%-8.97%+91.20%+232.03% 5.42TCr
-6.29%-7.73%+95.82%+19.59% 4.52TCr
-6.25%+0.70%+257.39%+266.85% 3.07TCr
-1.92%-3.86%+130.54%+183.59% 2.6TCr
+4.43%+5.36%+782.40%+844.36% 2.42TCr
Average -1.26%+4.05%+240.18%+298.88% 9.69TCr
Weighted average by Cap. +0.32%+16.02%+232.89%+316.48%

Financials

2008 2009
Net sales 95.54L 83.88L 77.21L 71.95L 1.36Cr 91Cr 1.38Cr 9.29Cr 3.6Cr 45Cr 3.59Cr 3.51Cr 155.17Cr 1.29Cr 1.13Cr 1.04Cr 96.94L 1.83Cr 122.39Cr 1.87Cr 13Cr 4.85Cr 60Cr 4.83Cr 4.73Cr 209.08Cr
Net income -45.08L -39.58L -36.43L -33.95L -64.02L -43Cr -65.33L -4.38Cr -1.7Cr -21Cr -1.69Cr -1.66Cr -73Cr -7L -6L -5L -5L -10L -6.46Cr -10L -66.1L -25.61L -3.17Cr -25.53L -24.98L -11Cr
Net Debt -0.19 -0.17 -0.15 -0.14 -0.27 -17.87 -0.27 -1.83 -0.71 -8.77 -0.71 -0.69 -30.53 -1.24 -1.09 -1 -0.93 -1.76 -117.89 -1.8 -12.05 -4.67 -57.87 -4.66 -4.56 -201.39
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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