SmartKem, Inc. announced the qualification of SmartKem's TRUFLEX® SL03 photocurable, organic dielectric for use with existing Build-up film (BF) materials as a redistribution layer to interconnect High-Performance Computing (HPC) silicon ICs. The HPC market is projected to grow from $3.60 billion to $4.99billion from 2022 to 2027, indicating significant opportunity as a result of this qualification. TRUFLEX® SL03 can be patterned by direct laser writing using Direct Lithography Technology to deliver a maskless process for rapid prototyping, with via hole sizes down to 3.7 Microns diameter, at a low process temperature of 150°C. It is photocurable at 10millijoules/cm2, enabling rapid production throughput.

The performance demonstrated in these tests illustrates the potential of this material for the next generation of high-density interconnects. A demonstration of this detailed performance can be seen at the ITRI (Industrial Technology Research Institute) booth, as well as high-resolution line width and high-end panel-level fan-out packaging or advanced IC substrate applications, at SEMICON Taiwan 2022 from 14th-16th of September 2022.