SHINEMORE TECHNOLOGY MATERIALS CO., LTD.

ShineMore Technology Materials Co., Ltd.

8291

TW0008291006

Semiconductors

End-of-day quote Taipei Exchange Other stock markets 03:30:00 31/05/2024 am IST			5-day change	1st Jan Change
12.4 ^TWD	+9.73%		+59.38%	+98.40%

16/05	ShineMore Technology Materials Co., Ltd. announced that it has received TWD 12 million in funding from Daito Me Co Ltd	CI
15/05	ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	CI

ShineMore Technology Materials Co., Ltd. announced that it has received TWD 39.384 million in funding from Daito Me Co Ltd and another investor

May 08, 2024

On May 8, 2024, ShineMore Technology Materials Co., Ltd. closed the transaction.

Latest news about ShineMore Technology Materials Co., Ltd.

ShineMore Technology Materials Co., Ltd. announced that it has received TWD 12 million in funding from Daito Me Co Ltd	16/05	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	15/05	CI
ShineMore Technology Materials Co., Ltd. announced that it expects to receive TWD 12 million in funding from Daito Me Co Ltd	10/05	CI
ShineMore Technology Materials Co., Ltd. announced that it has received TWD 39.384 million in funding from Daito Me Co Ltd and another investor	08/05	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	28/03	CI
ShineMore Technology Materials Co., Ltd. announced that it expects to receive TWD 39.384 million in funding from Daito Me Co Ltd and another investor	16/01	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	13/11	CI
ShineMore Technology Materials Co., Ltd. announced that it expects to receive funding from Daito Me Holdings Co., Ltd	08/11	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	11/23/11	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	12/23/12	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	30/23/30	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	11/22/11	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	12/22/12	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022	13/22/13	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2021	29/22/29	CI
Shinemore Technology Materials Co., Ltd. Announces Board Changes, Effective December 23, 2021	22/21/22	CI
ShineMore Technology Materials Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	12/21/12	CI
Shinemore Technology Materials Co., Ltd. Announces Audit Committee Appointments	27/21/27	CI
Shinemore Technology Materials Co., Ltd. Reports Earnings Results for the Second Quarter Ended June 30, 2021	12/21/12	CI
Shinemore Technology Materials Co., Ltd. Announces Resignation of Tsai, Mei-Li	03/21/03	CI
Shinemore Technology Materials Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2021	13/21/13	CI
ShineMore Technology Materials Co., Ltd. Auditor Raises 'Going Concern' Doubt	30/21/30	CI
Shinemore Technology Materials Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2020	25/21/25	CI
ShineMore Technology Materials Co., Ltd. announced that it expects to receive TWD 50.22 million in funding from Daito Me Holdings Co., Ltd	20/21/20	CI
Shinemore Technology Materials Co., Ltd. Reports Earnings Results for the Third Quarter Ended September 30, 2020	12/20/12	CI

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ShineMore Technology Materials Co., Ltd. is a Taiwan-based company principally engaged in the manufacture, processing and sales of copper clad circuit laminations. The Company's main products include copper clad laminations (CCLs), adhesive film, parts and components and others. The Company's products are mainly used in consumer electronics, home appliances, automobiles, high speed computing, high-frequency communications and cloud computing. The Company distributes its products in domestic market and to overseas markets.

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Semiconductors

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