Qingyang Packaging Technology Co., Ltd. announced that it expects to receive CNY 30 million in funding from Shanghai Sunglow Packaging Technology Co.,Ltd
Qingyang Packaging Technology (Shanghai) Co., Ltd. announced that it will raise CNY 30,000,000 in a equity round of funding on December 2, 2020. The transaction included participation from returning investor Shanghai Sunglow Packaging Technology Co.,Ltd (SHSE:603499) for 100% stake in the company. The company registered capital will increase from CNY 49,580,720 to CNY 79,580,720 after the capital increase. The transaction was approved in thirty-fourth meeting of 2nd directorate by board of directors. The transaction is not subjected to share holders approval.