Announcement of KINSUS' FY2022/Q2 Consolidated
Financial Statements approved by Board of Directors
Date of events
2022/07/25
To which item it meets
paragraph 31
Statement
1.Date of submission to the board of directors or approval by the board of
directors:2022/07/25
2.Date of approval by the audit committee:2022/07/25
3.Start and end dates of financial reports or annual self-assessed financial
information of the reporting period (XXXX/XX/XX~XXXX/XX/XX):
2022/01/01~2022/06/30
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):21,467,870
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD):7,771,543
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD):4,803,981
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD):5,139,630
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD):4,016,045
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD):3,625,073
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD):8.04
11.Total assets end of the period (thousand NTD):62,956,257
12.Total liabilities end of the period
(thousand NTD):28,338,596
13.Equity attributable to owners of parent end of the
period (thousand NTD):30,721,715
14.Any other matters that need to be specified:None
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Kinsus Interconnect Technology Corp. published this content on 25 July 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 25 July 2022 10:13:07 UTC.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.