Valuation: Kinsus Interconnect Technology Corp.

Market Cap 40TCr 1.25TCr 1.1TCr 1.01TCr 939.19Cr 1.78TCr 1,19600Cr 1.81TCr 12TCr 4.71TCr 59TCr 4.71TCr 4.61TCr 2,03600Cr P/E 2026 *
75.1x
P/E 2027 * 35x
Enterprise Value 40TCr 1.25TCr 1.09TCr 1TCr 932.7Cr 1.77TCr 1,18800Cr 1.8TCr 12TCr 4.68TCr 58TCr 4.68TCr 4.58TCr 2,02200Cr EV / Sales 2026 *
7.47x
EV / Sales 2027 * 5.24x
Free-Float
63.17%
Yield 2026 *
0.58%
Yield 2027 * 1.28%
1 day-8.40%
1 week-4.27%
Current month-14.37%
1 month+7.16%
3 months+127.08%
6 months+354.17%
Current year+379.87%
1 week 763
Extreme 763
939
1 month 594
Extreme 594
939
Current year 151.5
Extreme 151.5
939
1 year 85.3
Extreme 85.3
939
3 years 60.8
Extreme 60.8
939
5 years 60.8
Extreme 60.8
939
10 years 30.3
Extreme 30.3
939
Manager TitleAgeSince
Chief Executive Officer - -
Director of Finance/CFO - 01/08/2000
Chief Operating Officer - -
Director TitleAgeSince
Chairman 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - 01/09/2003
Change 5-day change 1-year change 3-year change Capi.($)
-8.40%-4.27%+765.08%+552.14% 1.37TCr
-1.67%+6.31%+219.77%+491.82% 21TCr
-2.38%-5.31%+72.35%+274.07% 10TCr
-9.95%+4.19%+493.17%+1,935.32% 6.82TCr
-3.55%-13.78%+426.90%+758.68% 6.25TCr
-5.37%-5.95%+677.12%+415.17% 4.82TCr
-3.14%+1.55%+279.81%+664.03% 4.56TCr
-4.97%-8.38%+100.10%+1,137.93% 4.38TCr
-1.00%+0.08% - - 4.35TCr
-4.82%-12.53%+172.37%+464.80% 3.84TCr
Average -4.53%-9.42%+356.30%+743.77% 6.74TCr
Weighted average by Cap. -3.64%-6.74%+286.23%+690.59%

Financials

2026 *2027 *
Net sales 5.34TCr 166.71Cr 146Cr 134.48Cr 124.82Cr 237.04Cr 16TCr 240.24Cr 1.61TCr 626.47Cr 7.81TCr 626.05Cr 612.32Cr 27TCr 7.54TCr 235.28Cr 206.05Cr 189.79Cr 176.17Cr 334.53Cr 22TCr 339.06Cr 2.27TCr 884.14Cr 11TCr 883.56Cr 864.17Cr 38TCr
Net income 521.43Cr 16Cr 14Cr 13Cr 12Cr 23Cr 1.55TCr 23Cr 157.09Cr 61Cr 761.72Cr 61Cr 60Cr 2.64TCr 1.06TCr 33Cr 29Cr 27Cr 25Cr 47Cr 3.16TCr 48Cr 319.99Cr 124.53Cr 1.55TCr 124.45Cr 121.72Cr 5.38TCr
Net Debt -277.96Cr -8.67Cr -7.6Cr -7Cr -6.49Cr -12Cr -827.22Cr -12Cr -84Cr -33Cr -406.05Cr -33Cr -32Cr -1.41TCr -708.03Cr -22Cr -19Cr -18Cr -17Cr -31Cr -2.11TCr -32Cr -213.3Cr -83Cr -1.03TCr -83Cr -81Cr -3.59TCr
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
06/26/06 NT$763.00 -8.40% 39,29,016
03/26/03 NT$833.00 +0.36% 33,49,718
02/26/02 NT$830.00 -6.53% 2,76,80,448
01/26/01 NT$888.00 -0.34% 3,87,28,579
30/26/30 NT$891.00 +10.00% 3,13,15,583
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
12
Last Close Price
763.00TWD
Average target price
761.75TWD
Spread / Average Target
-0.16%

Quarterly revenue - Rate of surprise

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