Valuation: Kinsus Interconnect Technology Corp.

Market Cap 51TCr 1.6TCr 1.4TCr 1.32TCr 1.2TCr 2.26TCr 1,52900Cr 2.27TCr 16TCr 6.13TCr 78TCr 5.99TCr 5.86TCr 2,51000Cr P/E 2026 *
90.9x
P/E 2027 * 38.9x
Enterprise Value 51TCr 1.61TCr 1.41TCr 1.33TCr 1.21TCr 2.27TCr 1,54100Cr 2.29TCr 16TCr 6.18TCr 79TCr 6.04TCr 5.91TCr 2,53000Cr EV / Sales 2026 *
9.68x
EV / Sales 2027 * 6.55x
Free-Float
60.38%
Yield 2026 *
0.49%
Yield 2027 * 1.18%
1 day+6.18%
1 week+15.62%
Current month+17.46%
1 month+15.21%
3 months+18.47%
6 months+173.68%
Current year+505.03%
1 week 824
Extreme 824
996
1 month 766
Extreme 766
996
Current year 151.5
Extreme 151.5
996
1 year 105
Extreme 105
996
3 years 60.8
Extreme 60.8
996
5 years 60.8
Extreme 60.8
996
10 years 30.3
Extreme 30.3
996
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 01/05/2022
Director of Finance/CFO - 01/08/2000
Director TitleAgeSince
Director/Board Member 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
+6.18%+15.62%+766.67%+778.54% 1.6TCr
+1.93%+12.21%+292.94%+600.00% 27TCr
-0.71%-2.76%-17.51%+219.95% 9.41TCr
+2.16%+20.80%+654.78%+563.87% 6.12TCr
+0.60%+3.27%+302.39%+1,136.23% 5.69TCr
-3.63%-5.18%+151.03%+974.47% 5.05TCr
-4.89%+2.60%+89.20%+670.05% 4TCr
+1.67%+19.23%+550.76%+504.61% 3.6TCr
-3.16%+0.45%+66.04%+454.29% 3.56TCr
-4.75%+2.48%-22.28%+920.57% 3.33TCr
Average -0.46%+6.87%+283.40%+682.26% 6.89TCr
Weighted average by Cap. +0.18%+7.72%+258.69%+627.85%

Financials

2026 *2027 *
Net sales 5.27TCr 165.99Cr 145.66Cr 137.57Cr 125.37Cr 234.68Cr 16TCr 236.35Cr 1.65TCr 637.6Cr 8.13TCr 623.23Cr 609.75Cr 26TCr 7.86TCr 247.2Cr 216.92Cr 204.87Cr 186.7Cr 349.5Cr 24TCr 351.99Cr 2.45TCr 949.56Cr 12TCr 928.15Cr 908.08Cr 39TCr
Net income 539.59Cr 17Cr 15Cr 14Cr 13Cr 24Cr 1.63TCr 24Cr 168.4Cr 65Cr 831.43Cr 64Cr 62Cr 2.67TCr 1.29TCr 41Cr 36Cr 34Cr 31Cr 57Cr 3.9TCr 58Cr 403.06Cr 156.11Cr 1.99TCr 152.59Cr 149.29Cr 6.4TCr
Net Debt 397.88Cr 13Cr 11Cr 10Cr 9.46Cr 18Cr 1.2TCr 18Cr 124.17Cr 48Cr 613.07Cr 47Cr 46Cr 1.97TCr 733.29Cr 23Cr 20Cr 19Cr 17Cr 33Cr 2.21TCr 33Cr 228.85Cr 89Cr 1.13TCr 87Cr 85Cr 3.63TCr
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
24/26/24 NT$962.00 +6.18% 4,27,03,311
23/26/23 NT$906.00 -0.33% 2,97,44,187
22/26/22 NT$909.00 +9.92% 2,80,86,027
21/26/21 NT$827.00 -0.60% 2,32,71,137
18/26/18 NT$832.00 +3.35% 1,67,02,063
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
962.00TWD
Average target price
952.77TWD
Spread / Average Target
-0.96%

Quarterly revenue - Rate of surprise

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