Valuation : Kinsus Interconnect Technology Corp.

Market Cap 43TCr 1.36TCr 1.17TCr 1.1TCr 1.01TCr 1.89TCr 1,28800Cr 1.89TCr 13TCr 5.06TCr 66TCr 5.12TCr 5.01TCr 2,12900Cr P/E 2026 *
77.4x
P/E 2027 * 33.2x
Enterprise Value 43TCr 1.37TCr 1.18TCr 1.11TCr 1.01TCr 1.89TCr 1,29200Cr 1.9TCr 13TCr 5.08TCr 66TCr 5.14TCr 5.03TCr 2,13500Cr EV / Sales 2026 *
8.3x
EV / Sales 2027 * 5.5x
Free-Float
60.38%
Yield 2026 *
0.57%
Yield 2027 * 1.39%
1 day+5.68%
1 week-8.90%
1 month+6.78%
3 months+18.35%
6 months+187.87%
Current year+415.09%
1 week 766
Extreme 766
900
1 month 766
Extreme 766
960
Current year 151.5
Extreme 151.5
960
1 year 102
Extreme 102
960
3 years 60.8
Extreme 60.8
960
5 years 60.8
Extreme 60.8
960
10 years 30.3
Extreme 30.3
960
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 01/05/2022
Director of Finance/CFO - 01/08/2000
Director TitleAgeSince
Director/Board Member 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
+5.68%-8.90%+695.15%+654.84% 1.36TCr
+1.73%+10.79%+218.77%+520.96% 22TCr
-1.25%-4.21%+20.00%+207.55% 9.75TCr
+2.36%-1.37%+385.65%+1,133.49% 6.13TCr
-0.27%-8.66%+207.10%+831.06% 4.85TCr
-2.28%-18.74%+575.66%+387.57% 4.68TCr
-4.40%-6.49% - - 3.76TCr
-2.85%-8.44%+96.56%+540.07% 3.37TCr
-4.23%-8.38%+87.77%+419.57% 3.2TCr
-1.35%-9.15%-10.95%+879.04% 3.13TCr
Average -0.69%-5.17%+252.86%+619.35% 6.25TCr
Weighted average by Cap. -0.12%+0.08%+215.35%+565.65%

Financials

2026 *2027 *
Net sales 5.21TCr 164.82Cr 141.83Cr 133.44Cr 121.9Cr 228.04Cr 16TCr 228.66Cr 1.58TCr 611.89Cr 7.98TCr 618.93Cr 605.43Cr 26TCr 7.86TCr 248.3Cr 213.66Cr 201.02Cr 183.64Cr 343.53Cr 23TCr 344.46Cr 2.38TCr 921.78Cr 12TCr 932.38Cr 912.05Cr 39TCr
Net income 539.59Cr 17Cr 15Cr 14Cr 13Cr 24Cr 1.61TCr 24Cr 163.17Cr 63Cr 826.19Cr 64Cr 63Cr 2.66TCr 1.29TCr 41Cr 35Cr 33Cr 30Cr 56Cr 3.85TCr 57Cr 390.54Cr 151.55Cr 1.98TCr 153.29Cr 149.95Cr 6.37TCr
Net Debt 133.29Cr 4.21Cr 3.63Cr 3.41Cr 3.12Cr 5.83Cr 397.78Cr 5.84Cr 40Cr 16Cr 204.09Cr 16Cr 15Cr 657.47Cr 27Cr 85.61L 73.67L 69.31L 63.32L 1.18Cr 81Cr 1.19Cr 8.19Cr 3.18Cr 41Cr 3.21Cr 3.14Cr 133.6Cr
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
04/26/04 NT$819.00 +5.68% 1,97,78,741
03/26/03 NT$775.00 -8.50% 2,70,84,870
02/26/02 NT$847.00 -3.09% 1,48,94,440
01/26/01 NT$874.00 +6.72% 3,63,68,169
31/26/31 NT$819.00 -8.90% 3,19,05,413
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
819.00TWD
Average target price
952.77TWD
Spread / Average Target
+16.33%

Quarterly revenue - Rate of surprise

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