INTEL CORPORATION On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations to enable its advanced semiconductor packaging technology, Foveros. The Rio Rancho site currently develops and manufactures Intel® Optane™ technology, embedded multi-die interconnect bridge, and Intel® silicon photonics technology. These technologies play an important role in optimizing semiconductor memory, packaging and connectivity.
- News Byte:Intel Opens Fab 9 in New Mexico
- News Byte:Intel to Invest $3.5 Billion to Expand New Mexico Manufacturing Operations
- Tech Policy@Intel Blog:Intel Expands Advanced Packaging Capabilities and Brings Jobs to New Mexico
- Replay:Intel Announces New Mexico Investment
New Mexico Gov. Michelle Lujan Grisham is interviewed by media Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. At an earlier news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
Keyvan Esfarjani, (second from left) Intel senior vice president and general manager of Manufacturing and Operations, and New Mexico by Gov. Michelle Lujan Grisham bump elbows Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. In the background: Mindy Koch (left), Intel New Mexico Corporate Services site manager, and Erika Edgerly (right), Intel New Mexico director of public affairs. During an earlier news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham (left) and Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations, display a plaque with a processor wafer on Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During a news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
U.S. Sen. Ben Ray Luján, of New Mexico, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
U.S. Rep. Teresa Leger Fernandez, of New Mexico, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
Katie Prouty, Intel vice president, Manufacturing and Operations, Fab 11x plant manager and Intel New Mexico site leader, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations, speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham is interviewed by media Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. At an earlier news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
Keyvan Esfarjani, (second from left) Intel senior vice president and general manager of Manufacturing and Operations, and New Mexico by Gov. Michelle Lujan Grisham bump elbows Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. In the background: Mindy Koch (left), Intel New Mexico Corporate Services site manager, and Erika Edgerly (right), Intel New Mexico director of public affairs. During an earlier news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham (left) and Keyvan Esfarjani, Intel senior vice president and general manager of Manufacturing and Operations, display a plaque with a processor wafer on Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During a news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham speaks Monday, May 3, 2021, at the Intel Campus at Rio Rancho, New Mexico. During the news conference, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technologies. (Credit: Walden Kirsch/Intel Corporation)
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In January 2024, an Intel manufacturing technician at Fab 11X in Rio Rancho, New Mexico, holds a small wafer containing Intel silicon photonics chips. These Intel products enable future data center bandwidth growth and next-generation 5G deployments using smaller form factors and higher speeds. (Credit: Intel Corporation)
An Intel manufacturing technician at Fab 11X in Rio Rancho, New Mexico, holds a bond module carrier containing a single silicon photonics chip in January 2024. These Intel products enable future data center bandwidth growth and next-generation 5G deployments using smaller form factors and higher speeds. (Credit: Intel Corporation)
A drone photo shows Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. Fab 9 is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. (Credit: Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham speaks to Intel New Mexico employees on Wednesday, Jan. 24, 2024, at the company's Rio Rancho campus. Attendees include (from left) Rio Rancho Mayor Greggory Hull, Sandoval County Commission Chairman David Heil, U.S. Rep. Teresa Leger Fernández, and U.S. Rep. Melanie Stansbury. (Credit: Intel Corporation)
Keyvan Esfarjani (center), Intel chief global operations officer, cuts the ribbon in the ceremonial opening of Fab 9 in Rio Rancho, New Mexico, on Wednesday, Jan. 24, 2024. He is joined at an employee celebration with local elected officials and Intel managers (from left): Rio Rancho Mayor Greggory Hull; Ali Diouf, Fab 9 factory manager; U.S. Rep. Teresa Leger Fernández; Sandoval County Commission Chairman David Heil; U.S. Rep. Melanie Stansbury; New Mexico Gov. Michelle Lujan Grisham; Esfarjani; Katie Prouty, Intel New Mexico plant manager; Peter Charvat, general manager of Disaggregation Manufacturing Organization; Brian Chavez, F11x factory manager; Mindy Koch, New Mexico Corporate Services site manager; and Kenneth Nava, New Mexico director of Fab Construction Enterprise. (Credit: Intel Corporation)
Manufacturing technicians work in the clean room of Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. (Credit: Intel Corporation)
A manufacturing technician looks through a window of advanced packaging equipment at Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. (Credit: Intel Corporation)
A photo from January 2024 at Intel's new Fab 9 in Rio Rancho, New Mexico shows chiplet bonding as part of Intel's advanced packaging technology called Foveros. This breakthrough 3D packaging technology offers flexible options for combining multiple chips that are optimized for power, performance and cost. (Credit: Intel Corporation)
A wafer moves through the manufacturing process at Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. (Credit: Intel Corporation)
In January 2024, an Intel manufacturing technician at Fab 11X in Rio Rancho, New Mexico, holds a small wafer containing Intel silicon photonics chips. These Intel products enable future data center bandwidth growth and next-generation 5G deployments using smaller form factors and higher speeds. (Credit: Intel Corporation)
An Intel manufacturing technician at Fab 11X in Rio Rancho, New Mexico, holds a bond module carrier containing a single silicon photonics chip in January 2024. These Intel products enable future data center bandwidth growth and next-generation 5G deployments using smaller form factors and higher speeds. (Credit: Intel Corporation)
A drone photo shows Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. Fab 9 is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. (Credit: Intel Corporation)
New Mexico Gov. Michelle Lujan Grisham speaks to Intel New Mexico employees on Wednesday, Jan. 24, 2024, at the company's Rio Rancho campus. Attendees include (from left) Rio Rancho Mayor Greggory Hull, Sandoval County Commission Chairman David Heil, U.S. Rep. Teresa Leger Fernández, and U.S. Rep. Melanie Stansbury. (Credit: Intel Corporation)
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An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
Workers at the Intel Rio Rancho campus in New Mexico help develop and manufacture technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)
The Intel Rio Rancho campus in New Mexico develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)
Workers at Fab 11x at the Intel Rio Rancho campus in New Mexico help develop and manufacture technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
Workers at the Intel Rio Rancho campus in New Mexico help develop and manufacture technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Walden Kirsch/Intel Corporation)
An aerial view shows the Intel Rio Rancho campus in New Mexico, where Intel develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)
The Intel Rio Rancho campus in New Mexico develops and manufactures technologies that optimize semiconductor packaging, memory and connectivity. On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. (Credit: Intel Corporation)
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- Fact Sheet: Intel in New Mexico
- Corporate Responsibility Report: Intel New Mexico RISE Report: Our Commitment to Our Community
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Intel Advanced Packaging in New Mexico's Fab 9, Manufacturing in Fab 11X (B-Roll)
Video footage from January 2024 shows Intel New Mexico's Fab 9 and Fab 11X in Rio Rancho. In January 2024, Intel celebrated the opening of Fab 9, part of the company's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. The Fab 9 and Fab 11X facilities represent the first operational site for mass production of Intel's Foveros 3D advanced packaging technology. The site is also Intel's first co-located high-volume advanced packaging site, marking an end-to-end manufacturing process and allowing for a more efficient supply chain from demand to final product. (Credit: Intel Corporation)
Download video: "Intel Advanced Packaging in New Mexico's Fab 9, Manufacturing in Fab 11X (B-Roll)"
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Intel New Mexico (B-Roll)
On May 3, 2021, Intel announced it will invest $3.5 billion in its New Mexico operations in support of advanced semiconductor packaging technology. The investment is expected to create at least 700 high-tech jobs, 1,000 construction jobs and support an additional 3,500 jobs in the state. Technologies developed and manufactured at the site play a unique role in Intel's new era of innovation by simplifying and optimizing semiconductor packaging, memory and connectivity. The following footage includes comments from Intel CEO Pat Gelsinger, as well as footage from the interior fabrication facility (or "fab") footage and the exterior of Intel's Rio Rancho campus in New Mexico. (Credit: Intel Corporation)
Download video: "Intel New Mexico (B-Roll)"
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Intel Corporation published this content on 19 March 2024 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 19 March 2024 16:29:08 UTC.
