Announcement regarding the construction of
new factory building,dormitory,parking on own land
Date of events
2022/04/18
To which item it meets
paragraph 20
Statement
1.Type of contract:Engaging others to build on own land.
2.Date of occurrence of the event:2021/05/19~2022/04/18
3.Counterparty to the contract and relationship with the Company:
Chien Ming Construction Co. Ltd.; Relationship: None.
4.Major content of the contract (including total contract amount,
anticipated monetary amount of participation in the investment, and start
and end dates of the contract), restrictive covenants, and other important
terms and conditions:
Total contract amount : NT$632.7 million (VAT excluded).
Restrictive covenants : None.
Other important terms and conditions: None.
5.Name of the professional appraisal firm or company and its
appraisal opinion:NA.
6.Name of the real property appraiser:NA.
7.Practice certificate number of the real property appraiser:NA.
8.Concrete purpose of the acquisition:For production and operation purpose.
9.Any dissenting opinions of directors to the present transaction:NA.
10.Whether the counterparty of the current transaction is a related party:No
11.Date of the board of directors resolution:NA
12.Date of ratification by supervisors or approval by
the audit committee:NA
13.The appraisal report has a limited price, specific price,
or special price:NA.
14.An appraisal report has not yet been obtained:NA.
15.Reason for an appraisal report not being obtained:NA.
16.Reason for any significant discrepancy with the appraisal reports and
opinion of the CPA:NA.
17.Name of the CPA firm:NA.
18.Name of the CPA:NA.
19.Practice certificate number of the CPA:NA.
20.Any other matters that need to be specified:None.
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Greatek Electronics Inc. published this content on 18 April 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 18 April 2022 09:53:05 UTC.
GREATEK ELECTRONICS INC. is a Taiwan-basd company principally engaged in the provision of integrated circuit (IC) packaging and testing services. The Companyâs packaging products mainly include traditional leadframe package, quad flat no-lead package, solder ball array packages, flip-chip packages and 8-wafer-level advanced packages. The Company's testing services include wafer testing and finished product testing services. The Company conducts its businesses in Taiwan, the Americas, Hongkong, Europe and the rest of Asia.
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