GPM Board of Directors approved the convening of
the 2022 Annual Shareholders' Meeting
Date of events
2022/03/16
To which item it meets
paragraph 17
Statement
1.Date of the board of directors resolution:2022/03/16
2.General shareholders' meeting date:2022/06/08
3.General shareholders' meeting location:Einstein Hall, HSP Link
Science-Based Industrial Park, Hsinchu, 30075, Taiwan)
4.Shareholders meeting will be held by means of (physical shareholders
meeting/ visual communication assisted shareholders meeting /
visual communication shareholders meeting):physical shareholders meeting
5.Cause for convening the meeting I.Reported matters:
(1)To report on the business of the Company in 2021.
(2)Audit committee's review report for 2021.
(3)To report on the distribution of employees''and directors'
remuneration for 2021.
(4)Report on amendments to the Regulations of buyback share
transfer to employee.
(5)Report on amendments to the Corporate Social Responsibility
Code of Practice.
6.Cause for convening the meeting II.Acknowledged matters:
To accept the 2021 Business Report and Financial Statements.
To approve the proposal for the distribution of 2021 earnings.
7.Cause for convening the meeting III.Matters for Discussion:
(1)Cash distribution from capital reserve
(2)To revise the Procedures for Acquisition and Disposal of Assets.
(3)To revise the Articles of Incorporation
(4)To revise the Rules and Procedures of the Shareholders'Meeting.
8.Cause for convening the meeting IV.Election matters:None
9.Cause for convening the meeting V.Other Proposals:None
10.Cause for convening the meeting VI.Extemporary Motions:None
11.Book closure starting date:2022/04/10
12.Book closure ending date:2022/06/08
13.Any other matters that need to be specified:None
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Disclaimer
GPM - Gallant Precision Machining Co. Ltd. published this content on 16 March 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 16 March 2022 08:27:02 UTC.
Gallant Precision Machining Co., Ltd. is a Taiwan-based company principally engaged in the design, manufacture and sales of display process equipment, semiconductor process equipment and intelligent automation equipment. The Company provides integrated circuit (IC) packaging front-end equipment, IC packaging back-end equipment, as well as thin film transistor (TFT)-LCD, organic light-emitting diode (OLED), three dimensions (3D) displays and touch panel equipment. The Company also provides manufacture and test equipment for solar panels, as well as automation handling systems and others. The Company distributes its products in domestic market and to overseas markets.