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EM Networks Corporation Share Price

Equities

A087730

KR7087730008

Commodity Chemicals

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EM Networks Corporation Reports Earnings Results for the Full Year Ended December 31, 2022 CI
EM Networks Corporation Reports Earnings Results for the Full Year Ended December 31, 2021 CI
NEPES AMC cancelled the acquisition of remaining 22% stake in NMT Co., Ltd.. CI
ESMO Materials Corporation announced that it expects to receive KRW 1.6 billion in funding from Samsung Securities Co. Ltd., Investment Arm, KEB Hana Bank, Investment Arm, Shinhan Financial Investment Co., Ltd. CI
ESMO Materials Corporation announced that it has received KRW 1.07654 billion in funding from NNF Co., Ltd. CI
ESMO Materials Corporation announced that it expects to receive KRW 1.07654 billion in funding from NNF Co., Ltd. CI
ESMO Materials Corporation announced that it has received KRW 15.5 billion in funding CI
ESMO Materials Corporation announced that it expects to receive KRW 15.5 billion in funding CI
ESMO Materials Corporation agreed to acquire an unknown minority stake in Global Rare Earth Limited for KRW 5.2 billion. CI
ESMO Materials Corporation announced that it has received KRW 10 billion in funding CI
ESMO Materials Corporation announced that it expects to receive KRW 10 billion in funding CI
NEPES AMC entered into a contract to acquire remaining 22% stake in NMT Co., Ltd. for KRW 7 billion. CI
GIL Co., Ltd. announced that it has received KRW 5 billion in funding from NEPES AMC CI
ESMO Materials Corporation announced that it has received KRW 44 billion in funding CI
An unknown buyer acquired 25.6% stake in NEPES AMC from Keystone Private Equity, a fund managed by Keystone Private Equity. CI
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Managers TitleAgeSince
Chief Executive Officer - 31/23/31
Chief Executive Officer - 31/23/31
Comptroller/Controller/Auditor 58 -
Members of the board TitleAgeSince
Director/Board Member - -
Director/Board Member 51 -
Director/Board Member 71 -
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EM Networks Corp, formerly ESMO Materials Corp, is a Korea-based company mainly engaged in the provision of plastic resins materials used for semiconductors. The Company's product portfolio consists of epoxy molding compound (EMC), printable die attach adhesives, clear molding compound (CMC), white epoxy molding compound and silicone encapsulant, which are used for semiconductors and light emitting diodes (LEDs), as well as underfill resin for chip-on-films (COFs). The Company's products are sold under the brand name of LEMOCOM. The Company distributes its products in domestic and overseas markets.
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