Valuation: Axcelis Technologies

Market Cap 325.21Cr 281.7Cr 266.38Cr 241.16Cr 452.61Cr 31TCr 456.01Cr 3.18TCr 1.22TCr 16TCr 1.22TCr 1.19TCr 50TCr P/E 2026 *
37.1x
P/E 2027 * 21.8x
Enterprise Value 325.21Cr 281.7Cr 266.38Cr 241.16Cr 452.61Cr 31TCr 456.01Cr 3.18TCr 1.22TCr 16TCr 1.22TCr 1.19TCr 50TCr EV / Sales 2026 *
3.68x
EV / Sales 2027 * 3.29x
Free-Float
99.32%
Yield 2026 *
-
Yield 2027 * -
Manager TitleAgeSince
Chief Executive Officer 55 11/05/2023
Director of Finance/CFO 53 12/03/2026
Chief Operating Officer - -
Director TitleAgeSince
Director/Board Member 72 01/05/2015
Director/Board Member 69 13/05/2015
Director/Board Member 55 11/05/2023
Change 5-day change 1-year change 3-year change Capi.($)
-0.65%-9.17%+89.03%+145.43% 62TCr
-2.26%-16.70%+123.89%+328.33% 34TCr
-0.55%-9.29%+124.26%+138.52% 15TCr
-3.27%-4.67%+254.49%+412.55% 8.46TCr
+0.81%-0.75% - - 3.52TCr
-1.13%-9.78%+41.15%+38.36% 1.96TCr
+3.22%0.00%+113.31%+59.28% 2TCr
+0.29%-10.17%+99.75%+236.06% 1.48TCr
-3.08%-13.70%+108.48%+95.04% 1.23TCr
Average -0.77%-5.38%+119.30%+181.69% 14.37TCr
Weighted average by Cap. -1.17%-8.18%+113.79%+209.84%

Financials

2026 *2027 *
Net sales 88Cr 77Cr 72Cr 66Cr 122.96Cr 8.48TCr 123.89Cr 863.6Cr 332.25Cr 4.3TCr 331.88Cr 324.52Cr 14TCr 99Cr 86Cr 81Cr 73Cr 137.61Cr 9.48TCr 138.65Cr 966.48Cr 371.83Cr 4.81TCr 371.41Cr 363.18Cr 15TCr
Net income 8.63Cr 7.48Cr 7.07Cr 6.4Cr 12Cr 828.23Cr 12Cr 84Cr 32Cr 419.95Cr 32Cr 32Cr 1.34TCr 14Cr 12Cr 12Cr 11Cr 20Cr 1.36TCr 20Cr 138.53Cr 53Cr 689.35Cr 53Cr 52Cr 2.2TCr
Net Debt - -
Logo Axcelis Technologies
Axcelis Technologies, Inc. is primarily a producer of ion implantation equipment used in the fabrication of semiconductor chips in the United States, Europe, and Asia. The Company is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the enabling steps in the IC manufacturing process. The Company's products include High Current, Medium Energy, High Energy, Mid Current, and GSD Ovation. The Company's Purion H6 next generation high current ion implanters deliver process control by leveraging its spot beam architecture, optimized for the full spectrum of high-current applications. The Company's Purion H200 is its state-of-the-art single wafer high current medium energy implanter. Its Purion XE Series high energy ion implanters use RF Linear Accelerator (LINAC) technology. The Company's Purion M ion implanters offer the broadest spectrum of mid-current doses available.
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