Valuation: Axcelis Technologies

Market Cap 392.41Cr 336.14Cr 314.52Cr 287.9Cr 540.31Cr 38TCr 547.45Cr 3.72TCr 1.45TCr 19TCr 1.47TCr 1.44TCr 62TCr P/E 2026 *
44.8x
P/E 2027 * 26.3x
Enterprise Value 392.41Cr 336.14Cr 314.52Cr 287.9Cr 540.31Cr 38TCr 547.45Cr 3.72TCr 1.45TCr 19TCr 1.47TCr 1.44TCr 62TCr EV / Sales 2026 *
4.44x
EV / Sales 2027 * 3.97x
Free-Float
99.32%
Yield 2026 *
-
Yield 2027 * -
Manager TitleAgeSince
Chief Executive Officer 55 11/05/2023
Director of Finance/CFO 53 12/03/2026
Chief Operating Officer - -
Director TitleAgeSince
Director/Board Member 72 01/05/2015
Director/Board Member 69 13/05/2015
Director/Board Member 55 11/05/2023
Change 5-day change 1-year change 3-year change Capi.($)
+0.04%-4.66%+133.05%+143.18% 68TCr
+1.12%-5.52%+213.75%+370.89% 39TCr
+0.50%-8.19%+170.17%+156.21% 16TCr
-0.51%-4.71%+309.06%+441.01% 8.11TCr
-0.67%-11.19%+63.70%+47.78% 2.2TCr
+0.54%-9.53%+118.88%+59.71% 1.98TCr
-0.84%-9.14%+128.04%+260.40% 1.54TCr
-1.84%-11.57%+170.35%+160.00% 1.44TCr
-1.18%-14.80%+108.63%+95.95% 1.25TCr
Average -0.32%-8.48%+157.29%+192.79% 15.43TCr
Weighted average by Cap. +0.32%-5.65%+169.13%+224.81%

Financials

2026 *2027 *
Net sales 88Cr 76Cr 71Cr 65Cr 121.65Cr 8.45TCr 123.26Cr 836.65Cr 326.27Cr 4.25TCr 331.75Cr 324.54Cr 14TCr 99Cr 85Cr 79Cr 73Cr 136.15Cr 9.46TCr 137.94Cr 936.32Cr 365.13Cr 4.75TCr 371.27Cr 363.2Cr 16TCr
Net income 7.79Cr 6.67Cr 6.24Cr 5.71Cr 11Cr 745.17Cr 11Cr 74Cr 29Cr 374.33Cr 29Cr 29Cr 1.24TCr 14Cr 12Cr 11Cr 10Cr 20Cr 1.36TCr 20Cr 134.21Cr 52Cr 681.2Cr 53Cr 52Cr 2.25TCr
Net Debt - -
Logo Axcelis Technologies
Axcelis Technologies, Inc. is primarily a producer of ion implantation equipment used in the fabrication of semiconductor chips in the United States, Europe, and Asia. The Company is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the enabling steps in the IC manufacturing process. The Company's products include High Current, Medium Energy, High Energy, Mid Current, and GSD Ovation. The Company's Purion H6 next generation high current ion implanters deliver process control by leveraging its spot beam architecture, optimized for the full spectrum of high-current applications. The Company's Purion H200 is its state-of-the-art single wafer high current medium energy implanter. Its Purion XE Series high energy ion implanters use RF Linear Accelerator (LINAC) technology. The Company's Purion M ion implanters offer the broadest spectrum of mid-current doses available.
Employees
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Global
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