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Valuation: Axcelis Technologies

Market Cap 576.35Cr 502.52Cr 465.42Cr 435.69Cr 817.11Cr 54TCr 822.05Cr 5.52TCr 2.14TCr 27TCr 2.16TCr 2.12TCr 93TCr P/E 2026 *
76.3x
P/E 2027 * 49.8x
Enterprise Value 576.35Cr 502.52Cr 465.42Cr 435.69Cr 817.11Cr 54TCr 822.05Cr 5.52TCr 2.14TCr 27TCr 2.16TCr 2.12TCr 93TCr EV / Sales 2026 *
6.83x
EV / Sales 2027 * 6.23x
Free-Float
99.32%
Yield 2026 *
-
Yield 2027 * -
Manager TitleAgeSince
Chief Executive Officer 55 11/05/2023
Director of Finance/CFO 53 12/03/2026
Chief Operating Officer - -
Director TitleAgeSince
Director/Board Member 72 01/05/2015
Director/Board Member 69 13/05/2015
Director/Board Member 55 11/05/2023
Change 5-day change 1-year change 3-year change Capi.($)
-1.09%+1.73%+153.84%+150.73% 73TCr
+3.97%+6.06%+321.77%+535.01% 49TCr
-0.95%+10.82%+214.00%+278.69% 21TCr
+3.03%+3.90%+319.86%+384.58% 8.5TCr
+1.69%+27.31%+1,838.61%+2,443.45% 3.65TCr
-2.39%+25.23%+251.18%+157.78% 3.06TCr
+13.62%+18.77%+134.48%+67.84% 2.73TCr
+4.66%+9.28%+344.30%+242.78% 2.24TCr
+1.95%+20.08%+214.90%+324.60% 1.96TCr
Average +2.72%+15.39%+421.44%+509.50% 18.36TCr
Weighted average by Cap. +1.02%+6.46%+261.56%+345.07%

Financials

2026 *2027 *
Net sales 84Cr 74Cr 68Cr 64Cr 119.64Cr 7.96TCr 120.37Cr 808.45Cr 313.32Cr 3.92TCr 316.78Cr 309.99Cr 14TCr 93Cr 81Cr 75Cr 70Cr 131.17Cr 8.73TCr 131.96Cr 886.34Cr 343.51Cr 4.3TCr 347.3Cr 339.85Cr 15TCr
Net income 7.17Cr 6.25Cr 5.79Cr 5.42Cr 10Cr 676.58Cr 10Cr 69Cr 27Cr 333.02Cr 27Cr 26Cr 1.16TCr 11Cr 9.22Cr 8.54Cr 7.99Cr 15Cr 997.72Cr 15Cr 101.29Cr 39Cr 491.09Cr 40Cr 39Cr 1.71TCr
Net Debt - -
Logo Axcelis Technologies
Axcelis Technologies, Inc. is primarily a producer of ion implantation equipment used in the fabrication of semiconductor chips in the United States, Europe, and Asia. The Company is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the enabling steps in the IC manufacturing process. The Company's products include High Current, Medium Energy, High Energy, Mid Current, and GSD Ovation. The Company's Purion H6 next generation high current ion implanters deliver process control by leveraging its spot beam architecture, optimized for the full spectrum of high-current applications. The Company's Purion H200 is its state-of-the-art single wafer high current medium energy implanter. Its Purion XE Series high energy ion implanters use RF Linear Accelerator (LINAC) technology. The Company's Purion M ion implanters offer the broadest spectrum of mid-current doses available.
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