ASIA METAL INDUSTRIES, INC. Asia Metal Industries, Inc. Share Price
Equities
6727
TW0006727001
Semiconductor Equipment & Testing
|
End-of-day quote
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|
5-day change | 1st Jan Change | ||
| 62.8 TWD | 0.00% |
|
+1.95% | +6.80% |
| Sales 2022 | 1.46B 45.1M 3.76B | Sales 2023 | 1.31B 40.6M 3.38B | Capitalization | 1.42B 43.86M 3.66B |
|---|---|---|---|---|---|
| Net income 2022 | 200M 6.2M 517M | Net income 2023 | 110M 3.41M 284M | EV / Sales 2022 | 1.18 x |
| Net Debt 2022 | 129M 3.99M 332M | Net cash position 2023 | 177M 5.48M 457M | EV / Sales 2023 | 0.95 x |
| P/E ratio 2022 |
8.8
x | P/E ratio 2023 |
14.1
x | Employees | - |
| Yield 2022 |
5.92% | Yield 2023 |
-
| Free-Float | 78.24% |
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* Assessed data
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| 1 week | +1.95% | ||
| Current month | +2.78% | ||
| 1 month | +8.28% | ||
| 3 months | +11.35% | ||
| 6 months | +6.26% | ||
| Current year | +6.80% |
1 week
60.70
63.20
1 month
57.0064.50
Current year
55.0064.50
1 year
54.9069.10
3 years
48.80128.00
5 years
42.00128.00
10 years
42.00128.00
| Managers | Title | Age | Since |
|---|---|---|---|
Yuan Tsai Huang
CEO | Chief Executive Officer | - | 04/16/04 |
Hsiu Ju Liang
DFI | Director of Finance/CFO | - | 01/18/01 |
Kuo Cheng Li
CTO | Chief Tech/Sci/R&D Officer | - | 01/07/01 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Tse Ming Lin
BRD | Director/Board Member | - | 30/18/30 |
Kuei Chuan Tsou
CHM | Chairman | - | 30/18/30 |
Yuan Tsai Huang
CEO | Chief Executive Officer | - | 04/16/04 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 03/24/03 | 62.8 | 0.00% | 139,601 |
| 02/24/02 | 62.8 | +2.78% | 247,386 |
| 30/24/30 | 61.1 | -0.65% | 109,445 |
| 29/24/29 | 61.5 | -1.13% | 156,363 |
| 26/24/26 | 62.2 | +0.97% | 116,158 |
End-of-day quote Taipei Exchange, May 03, 2024
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ASIA METAL INDUSTRIES, INC. is a Taiwan-based company mainly engaged in the manufacture and sale of printed circuit board substrates processing equipment and thin films processing equipment, as well as the sale services business. The Company is mainly engaged in the production of copper foil substrates vertical treating equipment, flexible circuit boards coating equipment, ceramic capacitors coating equipment, low temperature co-fired ceramics (LTCC) coating equipment and energy substrates processing equipment. The Company distributes its products in domestic market and to mainland China market.
| 1st Jan change | Capi. | |
|---|---|---|
| +6.80% | 47.84M | |
| +25.93% | 164B | |
| +32.90% | 32.75B | |
| +27.42% | 30.63B | |
| -18.70% | 26.73B | |
| +29.83% | 23.4B | |
| -7.77% | 12.14B | |
| -8.13% | 9.92B | |
| +110.70% | 9.36B | |
| +33.93% | 6.22B |
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