Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys'ysics solver results through real-time visualization. Ansys is ushering in the next generation of semiconductor system design to improve outcomes in applications including 5G/6G, Internet of Things (IoT), artificial intelligence (AI)/machine learning (ML), cloud computing, and autonomous vehicles. 3D-ICs, or multi-die chips, are vertically stacked assemblies of semiconductor chips.

A 3D-IC's compact form factor offers significant performance gains without increasing power consumption. However, denser 3D-ICs complicate design challenges related to electromagnetic issues and the management of heat and stress. It also makes tracing the origins of these problems more difficult.

To understand the interactions between 3D-IC components for more advanced applications, 3D multiphysics visualization becomes a requirement for effective design and diagnostics. Ansys' integration of NVIDIA Omniverse, a platform of APIs for developing OpenUSD- and NVIDIA RTX-enabled 3D applications and workflows, will deliver the real-time 3D-IC visualization of results from Ansys solvers, including Ansys HFSS?Ansys Icepak?, and Ansys RedHawk-SC?. This will help designers interact with 3D models to evaluate critical phenomena like electromagnetic fields and temperature variations.

This interactive solution allows designers to optimize next-generation chips to deliver faster data rates, increased functionality, and improved reliability.