Shanghai Xingsi Semiconductor Co., Ltd. announced that it will issue CNY 180 million in an equity round of funding from new investor Anhui Landun Photoelectron Co., Ltd. on December 29, 2023. The transaction was approved by the board of directors of the investor at its 12th session of the company?s 6th directorate and the 11th session of the company?s 6th supervisory board.
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5-day change | 1st Jan Change | ||
22.76 CNY | +1.52% |
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06/06 | Anhui Landun Photoelectron Co., Ltd. Announces Dividend on Share A for the Year 2023, Payable on June 14, 2024 | CI |
14/05 | Anhui Landun Photoelectron Co., Ltd. Approves Cash Dividend for 2023 | CI |
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-10.25% | 2.7B |
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- Shanghai Xingsi Semiconductor Co., Ltd. announced that it expects to receive CNY 180 million in funding from Anhui Landun Photoelectron Co., Ltd.