Aehr Test Systems announced that it will be showcasing its FOX-XPTM next generation multi-wafer test and burn-in systems for high volume production and early failure rate (EFR) test in booth 315 at the 2018 International Test Conference (ITC) taking place October 28-November 2 in Phoenix, Arizona at the Phoenix Convention Center. ITC is the world’s premier conference dedicated to electronics test. This year features numerous topics including emerging test needs for artificial intelligence, automotive and IoT, hardware security, system test, analog and mixed-signal test, yield learning, test analytics, test methodology, benchmarks, test standards, memory and 3D test, diagnosis, DFT architectures, and functional and software-based test. There will also be focus Workshops on both Automotive Reliability and Test (ART 2018) and Silicon Photonics Design and Test (SPDT 2018). ITC Tutorials and the Automotive Workshop this year highlight the IC industry’s drive towards Zero Defect IC quality - especially in the expanding automotive market. With the anticipated emergence of autonomous vehicles, reliability and safety are paramount issues for automotive manufacturers and especially their customers. In addition, these requirements are important for reliability-critical applications such as sensors and security devices in mobile smartphones and tablets, and are creating new need for reliability and assurance of operation in wearable biosensors. The Silicon Photonics Design and Test Workshop focuses on the expanded use of photonics devices in data communications and other applications. Aehr Test’s reliability screening solutions directly address the needs to be discussed in both the Automotive and Silicon Photonics Workshops. The solutions Aehr Test will feature at its ITC exhibit booth include: The FOX-XP system, the company’s next-generation multi-wafer and now singulated die/module test solution is capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other ICs in wafer form before they are assembled into single or multi-die stacked packages. The FOX wafer-level systems utilize Aehr Test's FOX WaferPakTM Contactors, which provide cost effective solutions for making electrical contact with a full wafer or substrate in a multi-wafer environment. The new configuration with the DiePak® Carriers also enables burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly process. The resulting known-good die, single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, photonics devices, highly valuable mobile applications, and mission critical integrated circuits and sensors. The ABTSTM family of packaged part burn-in and test systems is based on a hardware and software platform that is designed to address not only today’s devices, but also future devices for many years to come. This system can test and burn-in high pin-count devices with configurations for both high-power and low-power applications. The key feature of the FOX-XP test cell that contributes to its cost-effectiveness is the ability to provide up to 2,048 “Universal Channels” per wafer or DiePak carrier, enabling the system to test all the devices on the wafer or DiePak Carrier in parallel. The innovative “Universal Channel” architecture allows any channel to perform any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus /capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing. A single FOX-XP test system may be configured with up to 18 slots of test resources enabling up to 18 WaferPak Contactors or DiePak Carriers to be tested simultaneously. The FOX-XP system also offers per slot high performance thermal chucks to enable managing the temperature of the high power density devices under test, and an 18-slot test system footprint similar to typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time. With the wafer throughput available in the ATE industry, the flexibility of Aehr Test’s new “Universal Channel” architecture, and the ability to perform both functional pattern verification and parametric testing at full-wafer parallel test, the FOX-XP system provides a highly differentiated solution from competitive alternatives.