Announcement of the merger with Zhengzhou Airport
Economy Zone WaferWorks Technology Corp. on behalf of
Wafer Works (Zhengzhou) Corp.
Date of events
2022/04/08
To which item it meets
paragraph 11
Statement
1.Type of merger and acquisition (e.g.merger, spin-off , acquisition,
or share transfer):Merger
2.Date of occurrence of the event:2022/04/08
3.Names of companies participating in the merger and acquisition
(e.g., name of the other company participating in
the merger, newly established company in a spin-off,
acquired company, or company whose shares are transferred):
Wafer Works (Zhengzhou) Corp.(surviving company)
Zhengzhou Airport Economy Zone WaferWorks Technology Corp.(dissolved company)
4.Trading counterparty (e.g., name of the other company
participating in the merger, company spinning off, or trading
counterparty to the acquisition or share transfer):
Wafer Works (Zhengzhou) Corp.
Zhengzhou Airport Economy Zone WaferWorks Technology Corp.
5.Relationship between the trading counterparty and the
Company (investee company in which the Company has
re-invested and has shareholding of XX%), explanation
of the reasons for the decision to acquire from or
transfer shares to an affiliated enterprise or related
party, and whether it will affect shareholders' equity:
Both parties are 100% owned by Wafer Works (Shanghai) Corp.
This merger is a consolidation of related companies and
does not affect shareholders' rights and interests
6.Purpose of the merger and acquisition :
integrate resources and optimize the management structure
7.Anticipated benefits of the merger and acquisition :
reduce management costs and improve operating efficiency
8.Effect of the merger and acquisition on net worth per share and
earnings per share:none
9.Share exchange ratio and calculation assumptions:not applicable
10.Whether the CPA, lawyer or securities underwriter issued
an opinion on the unreasonableness regarding the transaction:not applicable
11.Name of accounting, law or securities firm:not applicable
12.Name of CPA or lawyer:not applicable
13.Number of CPA or lawyer license:not applicable
14.Estimated date of completion:
Reference date of the merge (2021.12.31) till the merger completed
15.Matters related to the assumption of corporate rights and
obligations of the dissolving company (or spin-off) by the
existing or newly-established company:none
16.Basic information of companies participating in the merger:
Wafer Works (Zhengzhou) Corp.
business scope: wafer doping and manufacturing
Zhengzhou Airport Economy Zone WaferWorks Technology Corp.
business scope: wafer doping and manufacturing
17.Matters related to the spin-off (including estimated value
of the business and assets planned to be transferred to
the existing company or new company.The total no.of shares
to be acquired by the spun-off company or its shareholders,
and their respective types and no.Matters related to the
reduction, if any, in capital of the spun-off company)
(note: not applicable for announcements unrelated to spin-offs):not applicable
18.Conditions and restrictions for future transfer of shares
resulting from the merger and acquisition :not applicable
19.Other important terms and conditions:none
20.Any objections from directors to the transaction:none
21.Is it related to new business model?:no
22.Explanation of new business model:none
23.Transactions with the counterparty for the past one year and
the next year:not applicable
24.Source of funds:not applicable
25.Any other matters that need to be specified:none
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Wafer Works Corporation published this content on 08 April 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 08 April 2022 13:39:05 UTC.
WAFER WORKS CORPORATION is a Taiwan-based company principally engaged in the development, design, manufacture and distribution of semiconductor products. The Company mainly operates through two business segments. The Operation of Semiconductor Products segment is mainly engaged in the manufacture and sales of semiconductor wafers. The Operation of Optoelectronic Products segment is mainly engaged in the manufacture and sales of optoelectronic products. The Companyâs primary products include silicon wafers, silicon rods, single-side polish wafers, double-side polish wafers, epitaxial wafers, sapphire wafers and substrates. The Company mainly distributes its products in domestic market and overseas markets, including the Mainland China, Hong Kong, the United States of America (the USA) and others.