1.Date of the board of directors' resolution:2022/02/24
2.Shareholders meeting date:2022/06/09
3.Shareholders meeting location:No. 203, Sec. 3, Jiayuan Rd.,
Shulin District, New Taipei City 238, Taiwan.
4.Cause for convening the meeting (1)Reported matters:
(A)FY2021 business report.
(B)The Audit Committee's Review Report on the 2021 Financial Statements.
(C)FY2021 Earnings Distribution of cash dividends.
(D)FY2021 remuneration of employees & directors report.
(E)The status of guarantee provided by Topoint as of the end of 2021.
5.Cause for convening the meeting (2)Acknowledged matters:
(A)Acknowledgment of financial results for FY2021.
(B)Acknowledgment of FY2021 profit distribution proposal.
6.Cause for convening the meeting (3)Matters for Discussion:
(A)Amendment to part of"The Articles of Association of the Company".
(B)Amendment to part of"The Procedure of the Acquisition and
Disposal of Assets".
7.Cause for convening the meeting (4)Election matters:
To elect a new Independent Director to fill the vacancy.
8.Cause for convening the meeting (5)Other Proposals:
To release the non-competition restriction on Directors.
9.Cause for convening the meeting (6)Extemporary Motions:None.
10.Book closure starting date:2022/04/11
11.Book closure ending date:2022/06/09
12.Any other matters that need to be specified:None.
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Topoint Technology Co. Ltd. published this content on 24 February 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 24 February 2022 06:21:10 UTC.
TOPOINT TECHNOLOGY CO., LTD. is principally engaged in the manufacture and distribution of precision processing tools for printed circuit boards (PCBs). The Companyâs main products consist of drill bits, including straight drill, under cut drill and inverse drill types; router bits, including diamond cut, chip break and two blade router types, as well as slot drills and milling cutters. Its products are applied primarily in computer, communication and consumer electronic (3C) industries for the processing and cutting of integrated circuit (IC) substrates, high density interconnect (HDI) PCBs and traditional PCBs, among others. The Company distributes its products primarily in Taiwan, Mainland China and other regions.