TE Connectivity and Credo teamed up to demonstrate the future of networking technologies. The companies will hold demonstrations of 112Gbps over a chip to module channel and over a backplane channel at DesignCon 2018. As industry groups such as OIF and IEEE meet to discuss feasibility of these types of links at these next-generation data rates, TE and Credo will be demonstrating performance on actual hardware. The IO channel demonstration uses TE's OSFP IO connector with Credo's 16nm, lower power, high performance 112G PAM4 SerDes technology to exhibit operation over a 10-inch printed circuit board (PCB) channel. The "O" is for "octal" — it is being designed to use eight electrical lanes to deliver 400GbE — and "SFP" is for "small form factor pluggable." The channel is driven by Credo's 112G PAM4 SerDes, which is operating over a total ball-to-ball channel loss of >15 decibel (dB). The demo shows bit error rate (BER) performance of better than 1e-7. The OSFP IO connector is a 8 channel IO connector currently adopted for 400Gbps applications. The demonstration establishes TE's OSFP connector performance as an 800Gbps-capable IO solution. The backplane demonstration uses TE's latest STRADA Whisper orthogonal backplane connector operating with a total channel loss of 20 dB at 28 GHz in a PCB-based direct plug orthogonal (DPO) architecture. Driven by Credo's 112G PAM4 SerDes, the demo shows BER performance levels that fully enable the adoption of STRADA Whisper solutions for the next wave of networking equipment.