TE Connectivity Ltd. announced the showcasing of OSFP and QSFP-DD connectivity products at 2018s DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices. TE will demonstrate the new products in booth 817 at the DesignCon 2018 expo on January 31-February 1 in Santa Clara, California. The OSFP form factor is designed for maximum thermal and electrical performance, but does not provide backwards compatibility to existing form factors without an adapter. The "O" is for "octal" — it is being designed to use eight electrical lanes to deliver 400GbE — and "SFP" is for "small form factor pluggable.