Tangshan Sunfar New Material Co., Ltd. announced that it will raise CNY 100 million in an equity round of funding on June 19, 2023. The transaction will include participation from returning investor, Tangshan Sunfar Silicon Industries Co.,Ltd., increasing its stake from 64% to 75.61%. The transaction has been approved by the shareholder's of the company in the 29th session of the company’s 4th directorate and the 17th session of the company’s 4th supervisory board.

Post the completion of the transaction, the registered capital of the company will increase from CNY 210 million to CNY 310 million.