Samsung Electronics Co., Ltd. announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to Preferred Networks, a leading Japanese AI company. By leveraging Samsung's foundry and advanced packaging products, Preferred Networks aims to develop powerful AI accelerators that meet the ever-growing demand for computing power driven by generative AI. Since starting mass production of the industry's first 3nm process node applying Gate-All-Around (GAA)istor architecture, Samsung has strengthened its GAA technology leadership by successfully winning orders for the 2nm process with further upgrades in performance and power efficiency.

The cooperation with Preferred Networks marks the first achievement for Japanese companies in the field of large-sized heterogeneous integrated package technologies and Samsung plans to accelerate its leading global advanced package market offensive. The 2.5D Advanced Package I-Cube S technology included in the turnkey solutions, is a heterogeneous integration package technology, with multiple chips in one package to enhance inter-connection speed and reduce package size. The use of the silicon interposer (Si-interposer) is crucial in achieving ultra-fine redistribution layer (RDL) and stabilizing power integrity for optimal semiconductor performance.

GAONCHIPS, a specialized system semiconductor development company, designed the chip. Based on this collaboration, Samsung and Preferred Networks plan to showcase AI chiplet solutions for the next-generation data center and generative AI computing market in the future.