Revasum announced the availability of 200mm SiC wafer polishing capability on the 6EZ platform. The 6EZ has already proven its value in high-volume manufacturing of 150mm SiC substrates and a 200mm conversion kit has now been fully tested and released, giving customers the option of upgrading 6EZ systems in the field. The 6EZ is the first single wafer CMP tool designed from the ground up for SiC wafer polishing.

The 6EZ's architecture coupled with patented cooling technology allows for the higher downforce and table speeds preferred for CMP of hard materials like SiC. The proprietary ViPRR carrier design secures the wafer while minimizing polishing friction on the pad to allow for reduced pad conditioning, better wafer-to-wafer consistency and extended consumables life.