Announcement of the second quarter of 2022
consolidated financial report approved by the Board
of Directors
Date of events
2022/07/25
To which item it meets
paragraph 31
Statement
1.Date of submission to the board of directors or approval by the board of
directors:2022/07/25
2.Date of approval by the audit committee:2022/07/25
3.Start and end dates of financial reports or annual self-assessed financial
information of the reporting period (XXXX/XX/XX~XXXX/XX/XX):
2022/01/01~2022/06/30
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):42,540,459
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD):21,683,424
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD):17,131,723
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD):17,109,937
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD):13,644,394
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD):13,644,394
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD):3.80
11.Total assets end of the period (thousand NTD):149,367,307
12.Total liabilities end of the period
(thousand NTD):72,488,854
13.Equity attributable to owners of parent end of the
period (thousand NTD):76,878,453
14.Any other matters that need to be specified:None.
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Powerchip Semiconductor Manufacturing Corporation published this content on 25 July 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 25 July 2022 10:03:06 UTC.
Powerchip Semiconductor Manufacturing Corp is a Taiwan-based company mainly engaged in the production and sales of packaging components, wafers and other electronic products. There are two types of semiconductor foundry services, including logic and special application product foundry, providing integrated circuit (IC) design company display driver IC products, power management chip products, discrete component products, complementary metal oxide semiconductor (CMOS) image sensor products, embedded non-volatile memory products, and memory product foundry, providing IC design company dynamic random access memory products, flash memory products. The main product of packaging components is memory particle products. Other design services include photomask services, silicon intellectual property services, design kit services, and others. The products are mainly sold to Asia, America and Europe.