Announcement of Board approved the 2022Q2
consolidated financial report.
Date of events
2022/07/27
To which item it meets
paragraph 31
Statement
1.Date of submission to the board of directors or approval by the board of
directors:2022/07/27
2.Date of approval by the audit committee:2022/07/27
3.Start and end dates of financial reports or annual self-assessed financial
information of the reporting period (XXXX/XX/XX~XXXX/XX/XX):
2022/01/01~2022/06/30
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):8,127,119
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD):1,404,312
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD):815,531
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD):976,700
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD):787,747
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD):787,747
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD):1.13
11.Total assets end of the period (thousand NTD):17,475,890
12.Total liabilities end of the period
(thousand NTD):8,492,915
13.Equity attributable to owners of parent end of the
period (thousand NTD):8,982,975
14.Any other matters that need to be specified:None.
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OSE - Orient Semiconductor Electronics Limited published this content on 27 July 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 27 July 2022 09:11:02 UTC.
Orient Semiconductor Electronics, Ltd. is a Taiwan-based company principally engaged in the research and development, design, manufacture and sales of integrated circuits (ICs) and electronic products. The Company operates through two business segments. The Electronic Manufacturing Services (EMS) segment includes printed circuit board (PCB) layouts, design for manufacturability (DFM) services, design for testing (DFT) services, prototype integration services, PCB assembly, function and reliability testing services and system integration services, among others. The IC Services segment includes the packaging and testing services of ICs and other semiconductor components. The Company operates businesses in domestic and overseas markets.