NEXTOOL TECHNOLOGY CO., LTD. Nextool Technology Co., Ltd. Share Price
Equities
688419
CNE100005V09
Semiconductor Equipment & Testing
|
End-of-day quote
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|
5-day change | 1st Jan Change | ||
| 27.85 CNY | +2.01% |
|
+4.11% | -21.66% |
Days
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| Sales 2022 | 269M 37.23M 3.1B | Sales 2023 | 198M 27.41M 2.28B | Capitalization | 2.92B 404M 33.6B |
|---|---|---|---|---|---|
| Net income 2022 | 57M 7.89M 657M | Net income 2023 | 52M 7.2M 599M | EV / Sales 2022 | 6.7 x |
| Net cash position 2022 | 792M 110M 9.13B | Net cash position 2023 | 814M 113M 9.38B | EV / Sales 2023 | 10.6 x |
| P/E ratio 2022 |
34.8
x | P/E ratio 2023 |
55.5
x | Employees | 477 |
| Yield 2022 |
0.95% | Yield 2023 |
0.84% | Free-Float | 25.41% |
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* Assessed data
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| 1 day | +2.01% | ||
| 1 week | +4.11% | ||
| Current month | +0.91% | ||
| 1 month | +21.46% | ||
| 3 months | +43.70% | ||
| 6 months | -35.59% | ||
| Current year | -21.66% |
1 week
25.72
27.92
1 month
21.8828.39
Current year
15.9135.60
1 year
15.9148.42
3 years
15.9154.50
5 years
15.9154.50
10 years
15.9154.50
| Managers | Title | Age | Since |
|---|---|---|---|
Tian Qin Zheng
CEO | Chief Executive Officer | 57 | 01/06/01 |
Chuan Wei Wang
DFI | Director of Finance/CFO | 41 | 08/05/08 |
Xiao Fu
CHM | Chairman | 48 | 01/06/01 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Ci Sheng Wu
BRD | Director/Board Member | 62 | 01/20/01 |
Xiang Long Fu
BRD | Director/Board Member | 60 | 01/06/01 |
La Mei Mao
BRD | Director/Board Member | 56 | 01/20/01 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 17/24/17 | 27.85 | +2.01% | 1,443,748 |
| 16/24/16 | 27.3 | +5.85% | 1,847,470 |
| 15/24/15 | 25.79 | -1.00% | 818,037 |
| 14/24/14 | 26.05 | +0.12% | 818,908 |
| 13/24/13 | 26.02 | -2.73% | 678,749 |
End-of-day quote Shanghai S.E., May 17, 2024
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Nextool Technology Co Ltd is a China-based company mainly engaged in the research, development, production and sales of intelligent manufacturing equipment. The Company provides customers with customized intelligent manufacturing equipment and system solutions. The Company's products mainly include plastic extrusion molding dies, extrusion molding devices and downstream equipment, as well as semiconductor packaging equipment and molds such as semiconductor automatic plastic packaging equipment, semiconductor automatic rib cutting and molding equipment, and semiconductor manual molding presses. The Company's products are mainly used in plastic extrusion molding and semiconductor packaging. The Company mainly operates its businesses in the domestic and overseas markets.
Calendar
16/08/2024
- Q2 2024 Earnings Release (Projected)
| 1st Jan change | Capi. | |
|---|---|---|
| -21.66% | 316M | |
| +30.86% | 176B | |
| +60.26% | 39.08B | |
| +38.27% | 34.77B | |
| -10.97% | 29.86B | |
| +18.43% | 21.39B | |
| -0.95% | 11.32B | |
| -14.90% | 11.22B | |
| +126.74% | 9.97B | |
| +25.61% | 5.77B |
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