Siemens' Embeddable BCI-ROM technology enables accurate reduced order thermal models of IC packages to be shared for 3D CFD thermal analysis in the electronics supply chain.
For the first time, high-fidelity thermal simulation data can be shared in the electronic supply chain while protecting semiconductor OEM's intellectual property
Siemens' Embeddable BCI-ROM technology provides reduced order models for the 3D CFD thermal simulation environment that maintains high accuracy in comparison to traditional fully detailed thermal models
Introduced in the latest updates to Simcenter Flotherm software for electronics cooling simulation from the Siemens Xcelerator portfolio of industry software, the breakthrough Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology allows a semiconductor company to generate an accurate model that can be shared with their clients for use in down-stream high-fidelity 3D thermal analysis without exposing the IC's internal physical structure.
Today's electronics often have heat dissipation challenges that need to be resolved during design due to higher power density influenced by the miniaturization of semiconductor packages and electronic systems, trends for thin-form consumer products, or demanding processing requirements. As a result, the need for more detailed thermal models to help solve thermal management design tasks is growing. Increasingly, modern IC package architectures such as 2.5D, 3D IC, or chiplet-based designs have highly complex thermal management challenges that require 3D thermal simulation both during their development and during integration of IC packages into electronics products.
'Given electronics supply chain pressures and the growing complexity of IC packages, barriers to collaboration and thermal analysis efficiency during design must be eliminated where possible to support competitive development,' said Jean-Claude Ercolanelli, Senior Vice President, Simulation and Test Solutions,
To learn more about Siemens' Embeddable BCI-ROM technology and how it can enable more efficient and secure collaboration, visit: https://blogs.sw.siemens.com/simcenter/embeddable-bci-rom-cfd-thermal-model/
Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.
Contacts for Press
Siemens Digital Industries Software PR Team
press.software.sisw@siemens.com
(C) 2024 Electronic News Publishing, source