Lingsen Precision Industries : Announcement that the company’s Second Quarter 2022 consolidated financial statements have been approved by the board of directors
Announcement that the company's Second Quarter
2022 consolidated financial statements have been approved
by the board of directors
Date of events
2022/08/08
To which item it meets
paragraph 31
Statement
1.Date of submission to the board of directors or approval by the board of
directors:2022/08/08
2.Date of approval by the audit committee:2022/08/08
3.Start and end dates of financial reports or annual self-assessed financial
information of the reporting period (XXXX/XX/XX~XXXX/XX/XX):2022/01/01~
2022/06/30
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):3,411,619
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD):503,317
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD):236,913
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD):282,763
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD):239,110
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD):226,928
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD):0.61
11.Total assets end of the period (thousand NTD):9,239,825
12.Total liabilities end of the period
(thousand NTD):3,354,595
13.Equity attributable to owners of parent end of the
period (thousand NTD):5,628,699
14.Any other matters that need to be specified:None
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Lingsen Precision Industries Ltd. published this content on 08 August 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 08 August 2022 09:23:03 UTC.
LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.
Lingsen Precision Industries : Announcement that the company’s Second Quarter 2022 consolidated financial statements have been approved by the board of directors