inspec Inc.

6656

JP3152650002

Semiconductor Equipment & Testing

Market Closed - Japan Exchange Other stock markets 11:30:00 09/05/2024 am IST			5-day change	1st Jan Change
970 ^JPY	-1.12%		-1.12%	-6.82%

2022	Inspec Inc. Completes the Development of the New RD3000FB	CI
2021	Gregory Stoeckli agreed to acquire 89% stake in First EIE SA from inspec Inc..	CI

Inspec Inc. announced that it has received ¥13.34601 million in funding

April 07, 2021

On April 7, 2021, inspec Inc. (TSE:6656) closed the transaction.

Latest news about inspec Inc.

Inspec Inc. Completes the Development of the New RD3000FB	02/22/02	CI
Gregory Stoeckli agreed to acquire 89% stake in First EIE SA from inspec Inc..	12/21/12	CI
Inspec Inc. announced that it has received ¥13.34601 million in funding	07/21/07	CI
Inspec Inc. announced that it expects to receive ¥13.34601 million in funding	22/21/22	CI
Inspec Inc. Announces Consolidated and Non-Consolidated Earnings Results for the Year Ended April 30, 2020	05/20/05	CI
Inspec Inc. Provides Consolidated Earnings Guidance for the Fiscal Year Ending April 30, 2021	05/20/05	CI
Inspec Inc. Announces Consolidated Earnings Results for the Nine Months Ended January 31, 2020; Provides Consolidated Earnings Guidance for the Fiscal Year Ending April 30, 2020	06/20/06	CI
Hachimaru Co.,Ltd., Obsession Ltd. and Innovation Engine, Inc. cancelled the acquisition of an unknown stake in Path Imaging Inc. from inspec Inc..	29/19/29	CI
Inspec Inc. Reports Consolidated Earnings Results for the First Quarter Ended July 31, 2019; Provides Earnings Guidance for the Year Ending April 2020	06/19/06	CI
Inspec Inc. Provides Dividend Guidance for the Year Ending April 2020	07/19/07	CI
Inspec Inc. Announces Consolidated and Non- Consolidated Earnings Results for the Year Ended April 2019; Provides Consolidated Earnings Guidance for the Year Ending April 2020	07/19/07	CI
Inspec Inc. Reports Consolidated Earnings Results for the Six Months Ended October 31, 2018; Provides Consolidated Earnings Guidance for the Full Year Ending April 30, 2019	07/18/07	CI
Hachimaru Co.,Ltd.,Obsession Ltd. and Innovation Engine, Inc. agreed to acquire an unknown stake in Path Imaging Inc. from inspec Inc. for ¥19.5 million.	29/18/29	CI
Inspec Inc. Reports Consolidated Earnings Results for the Three Months Ended July 31, 2018; Provides Consolidated Earnings Guidance for the Full Year Ended April 30, 2019	07/18/07	CI
Inspec Inc. Reports Consolidated and Non-Consolidated Earnings Results for the Fiscal Year Ended April 30, 2018; Provides Consolidated Earnings Guidance for the Fiscal Year Ending April 30, 2019	08/18/08	CI
Inspec Inc. Reports Consolidated Earnings Results for the Nine Months Ended January 31, 2018; Provides Consolidated Earnings Guidance for the Fiscal Year Ending April 30, 2018	09/18/09	CI
Inspec Inc. announced that it has received ¥5.412 million in funding	31/17/31	CI
Inspec Inc. announced that it expects to receive ¥5.41 million in funding	05/17/05	CI
Inspec Inc. completed the acquisition of an additional 38% stake in First EIE SA from Michel A. Juillerat and Sylvain C. Skynazy.	08/17/08	CI
Inspec Inc. agreed to acquire an additional 38% stake in First EIE SA from Michel A. Juillerat and Sylvain C. Skynazy for CHF 3.3 million.	18/17/18	CI
Inspec Inc. announced that it has received ¥2.6 million in funding	27/17/27	CI
Inspec Inc. announced that it expects to receive ¥2.6 million in funding	10/17/10	CI
Tera Co., Ltd. announced that it expects to receive ¥150 million in funding from Jikei Co.,Ltd., You Planning Co., Ltd., Innovation Engine, Inc., inspec Inc..	19/15/19	CI
Inspec Inc. completed the acquisition of 51% stake in First EIE SA from Sylvain Skynazy and Michel Juillerat.	30/15/30	CI
Inspec Inc. concluded a share transfer contract to acquire 51% stake in First EIE SA from Sylvain Skynazy and Michel Juillerat for ¥480 million.	19/15/19	CI

inspec Inc. is engaged in the manufacturing and sales of semiconductor package substrates and precision substrate inspection equipment, precision substrate manufacturing equipment and digital pathology related equipment. The Company operates in three segments. Semiconductor Package Substrates and Precision Substrate Inspection Equipment segment is engaged in the development and manufacturing of appearance inspection equipment such as semiconductor package substrates and precision printed circuit boards used for advanced digital devices such as smartphones, tablets, personal computers (PCs) and wearable terminals. Precision Substrate Manufacturing Equipment segment develops, manufactures, sells and provides maintenance services for photoplotters for printed circuit boards, inkjet printers, and direct imaging devices. Digital Pathology Related Equipment develops, manufactures and sells medical image processing system whole slide imaging (WSI).

Sector

Semiconductor Equipment & Testing

Calendar

07/06/2024 - Q4 2024 Earnings Release (Projected)

More about the company

Sector Semiconductor Testing Equipment & Service

	1st Jan change	Capi.
INSPEC INC.	-6.82%	25.26M
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TONGFU MICROELECTRONICS CO.,LTD	-11.38%	4.29B
TIANSHUI HUATIAN TECHNOLOGY CO., LTD.	-5.16%	3.58B
KING YUAN ELECTRONICS CO., LTD.	+3.18%	3.31B
HANGZHOU CHANGCHUAN TECHNOLOGY CO.,LTD	-23.66%	2.52B
ISC CO., LTD.	+1.25%	1.22B
SIGURD MICROELECTRONICS CORPORATION	+20.09%	1.11B

Semiconductor Testing Equipment & Service

inspec Inc.

Equities

6656

JP3152650002

Semiconductor Equipment & Testing

Inspec Inc. announced that it has received ¥13.34601 million in funding

Latest news about inspec Inc.

Chart inspec Inc.

Company Profile

Sector Semiconductor Testing Equipment & Service