INPAQ TECHNOLOGY CO., LTD. |
End-of-day quote
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|
5-day change | 1st Jan Change | ||
| 82.8 TWD | +1.72% |
|
+0.61% | -0.84% |
| Sales 2022 | 6.29B 193M 16.09B | Sales 2023 | 6.6B 203M 16.9B | Capitalization | 12.44B 382M 31.84B |
|---|---|---|---|---|---|
| Net income 2022 | 591M 18.14M 1.51B | Net income 2023 | 715M 21.95M 1.83B | EV / Sales 2022 | 1.23 x |
| Net Debt 2022 | 450M 13.82M 1.15B | Net cash position 2023 | 113M 3.47M 289M | EV / Sales 2023 | 1.87 x |
| P/E ratio 2022 |
12.4
x | P/E ratio 2023 |
16.8
x | Employees | - |
| Yield 2022 |
3.28% | Yield 2023 |
-
| Free-Float | 56.26% |
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* Assessed data
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| 1 day | +1.72% | ||
| 1 week | +0.61% | ||
| Current month | -3.27% | ||
| 1 month | -3.83% | ||
| 3 months | +9.52% | ||
| 6 months | +23.77% | ||
| Current year | -0.84% |
1 week
78.10
83.50
1 month
78.1089.10
Current year
72.1090.20
1 year
45.4091.90
3 years
38.6091.90
5 years
18.0093.20
10 years
17.0593.20
| Managers | Title | Age | Since |
|---|---|---|---|
Ming Tsan Tseng
CEO | Chief Executive Officer | - | 24/18/24 |
Tun Jen Cheng
CEO | Chief Executive Officer | - | 15/98/15 |
Kuo Shu Huang
DFI | Director of Finance/CFO | - | - |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Yu Heng Chiao
BRD | Director/Board Member | 61 | 24/18/24 |
Chi Tsu Kao
BRD | Director/Board Member | - | 13/08/13 |
Tun Jen Cheng
CEO | Chief Executive Officer | - | 15/98/15 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 26/24/26 | 82.8 | +1.72% | 1,403,694 |
| 25/24/25 | 81.4 | -1.33% | 1,197,426 |
| 24/24/24 | 82.5 | +4.43% | 3,280,606 |
| 23/24/23 | 79 | -2.11% | 3,460,573 |
| 22/24/22 | 80.7 | -1.94% | 1,543,843 |
End-of-day quote Taipei Exchange, April 26, 2024
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INPAQ TECHNOLOGY CO., LTD. is a Taiwan-based company principally engaged in the research, development, manufacture and sales of protection components and high-frequency components. The Company operates through two main segments. The Protection Components segment is mainly engaged in the research, manufacture and sales of electromagnetic prevention components, overvoltage protection components and over-current protection components. The High-frequency Components segment is primarily involved in the research, manufacture and sales of global positioning system (GPS) satellite antennas and modules, Bluetooth antennas, global system for mobile communications (GSM), code division multiple access (CDMA) and the third generation (3G) antennas, wireless local area network (WLAN) and wireless fidelity (WIFI), as well as various other antennas and modules. The Company distributes its products both in domestic market and to overseas markets.
Annual profits - Rate of surprise
| 1st Jan change | Capi. | |
|---|---|---|
| -0.84% | 378M | |
| -0.21% | 42.94B | |
| +148.96% | 4.73B | |
| +1.47% | 2.92B | |
| -6.30% | 2.7B | |
| +84.83% | 1.16B | |
| -3.89% | 1.04B | |
| -34.98% | 1.04B | |
| +61.96% | 1.03B | |
| -16.00% | 900M |
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