Optimized Mid-Voltage MOSFETs Provide Four Times Less Junction-to-Ambient Thermal Resistance

SAN JOSE, Calif. - January 7, 2013 - Designers of DC-DC conversion applications are challenged with improving power density while saving board space and reducing thermal resistance. Fairchild Semiconductor's (NYSE: FCS) new mid-voltage PowerTrench® MOSFETs with Dual Cool™ packaging technology are well suited to help with these design challenges.

Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100V mid-voltage series. Silicon technology advancements, paired with the Dual Cool technology, provide excellent switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5mm x 6mm MLP.

Devices included in the mid-voltage series include the 40V FDMS8320LDC, 60V FDMS86500DC, 80V FDMS86300DC and the 100V FDMS86101DC. These devices are synchronous rectifying MOSFETs that are suitable for use in DC-DC converters, telecom secondary-side rectification and high-end server/workstation applications. For additional information on devices available in the Dual Cool package, please visit our website at www.fairchildsemi.com/dualcool.

Features and Benefits:

FDMS8320LDC (40V)

  • Max RDS(ON) = 1.1m

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