Di-Nikko Engineering Co., Ltd.

6635

JP3493200004

Electronic Equipment & Parts

Market Closed - Japan Exchange Other stock markets 11:30:00 21/06/2024 am IST			5-day change	1st Jan Change
632 ^JPY	-2.02%		-2.32%	+34.18%

2023	Top Knowledge Investments Limited agreed to acquire New Trois Electronics Ltd. from Di-Nikko Engineering Co., Ltd. for ¥580 million.	CI
2023	Di-Nikko Engineering Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	CI

Di-Nikko Engineering Co., Ltd. authorizes a Buyback Plan.

February 12, 2015

The Board of Directors of Di-Nikko Engineering Co., Ltd. has authorized a buyback plan on February 12, 2015.

Latest news about Di-Nikko Engineering Co., Ltd.

Top Knowledge Investments Limited agreed to acquire New Trois Electronics Ltd. from Di-Nikko Engineering Co., Ltd. for ¥580 million.	22/23/22	CI
Di-Nikko Engineering Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	12/23/12	CI
Di-Nikko Engineering Co., Ltd. announced that it has received ¥580.32 million in funding from Leewo Investment Group Limited	10/22/10	CI
Di-Nikko Engineering Co., Ltd. agreed to acquire a 58% stake in Wuxi Rongzhi Electronics Co., Ltd. from Leewo Investment Group Limited for approximately ¥580 million.	14/22/14	CI
Di-Nikko Engineering Co., Ltd. announced that it expects to receive Ã‘580.32 million in funding from Leewo Investment Group Limited	14/22/14	CI
Huizhou Trois CaiHuang Electronics Co., Ltd announced that it expects to receive funding from Di-Nikko Engineering Co., Ltd.	25/21/25	CI
Di-Nikko Engineering Co., Ltd. cancelled the acquisition of print wiring board manufacturing business from Tochigi Denshi Kogyo Co.,Ltd.	12/20/12	CI
Di-Nikko Engineering Co., Ltd. agreed to acquire print wiring board manufacturing business from Tochigi Denshi Kogyo Co.,Ltd.	12/19/12	CI
Tranche Update on Di-Nikko Engineering Co., Ltd.'s Equity Buyback Plan announced on May 11, 2017.	02/17/02	CI
Di-Nikko Engineering Co., Ltd.'s Equity Buyback announced on May 11, 2017 has expired with 16,100 shares, representing 0.62% for ¥12.15 million.	29/17/29	CI
Tranche Update on Di-Nikko Engineering Co., Ltd.'s Equity Buyback Plan announced on May 11, 2017.	03/17/03	CI
Di-Nikko Engineering Co., Ltd. announces an Equity Buyback for 30,000 shares, representing 1.15% for ¥30 million.	11/17/11	CI
Di-Nikko Engineering Co., Ltd. authorizes a Buyback Plan.	11/17/11	CI
Tranche Update on Di-Nikko Engineering Co., Ltd.'s Equity Buyback Plan announced on August 7, 2015.	05/16/05	CI
Di-Nikko Engineering Co., Ltd.'s Equity Buyback announced on August 7, 2015 has expired with 32,300 shares, representing 1.22% for ¥25.19 million.	30/15/30	CI
Tranche Update on Di-Nikko Engineering Co., Ltd.'s Equity Buyback Plan announced on August 7, 2015.	01/15/01	CI
Di-Nikko Engineering Co., Ltd. announces an Equity Buyback for 50,000 shares, representing 1.89% for ¥50 million.	07/15/07	CI
Di-Nikko Engineering Co., Ltd. authorizes a Buyback Plan.	07/15/07	CI
Tranche Update on Di-Nikko Engineering Co., Ltd.'s Equity Buyback Plan announced on February 12, 2015.	01/15/01	CI
Di-Nikko Engineering Co., Ltd.’s Equity Buyback announced on February 12, 2015 has expired with 25,200 shares, representing 0.95% for ¥18.31 million.	30/15/30	CI
Tranche Update on Di-Nikko Engineering Co., Ltd.'s Equity Buyback Plan announced on February 12, 2015.	01/15/01	CI
Di-Nikko Engineering Co., Ltd. authorizes a Buyback Plan.	12/15/12	CI
Di-Nikko Engineering Co., Ltd. announces an Equity Buyback for 50,000 shares, representing 1.87% for ¥50 million.	12/15/12	CI
Tranche Update on Di-Nikko Engineering Co., Ltd.'s Equity Buyback Plan announced on August 8, 2014.	05/15/05	CI
Di-Nikko Engineering Co., Ltd.'s Equity Buyback announced on August 8, 2014, has expired with 29,900 shares, representing 1.11% for ¥21.48 million.	30/14/30	CI

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Di-Nikko Engineering Co., Ltd. is a Japan-based company mainly engaged in the commissioned processing of electronic modules to electronic equipment makers. The Electronic Components Implementation department is engaged in the implementation of electronic components to printed-circuit boards (PCBs) by robots and by hand. The Equipment Assembly department is engaged in the assembly and manufacturing of electronic modules mainly used for digital camera lens and other end products. The Company is also engaged in the sale of office machinery, as well as the provision of manpower dispatching and contracting services. The Company's products are used in office business equipment, industrial equipment, optical equipment and civil life equipment, among others.

Sector

Electronic Equipment & Parts

Calendar

08/08/2024 - Q2 2024 Earnings Release (Projected)

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