ANSYS, Inc. announced it is joining the Intel Foundry Accelerator USMAG Alliance to support the design of secure and efficient chips for national security and government applications. Through this alliance, Ansys' semiconductor simulation tools will be optimized to deliver secure design methodologies and workflows to meet the requirements of Intel Foundry's process design kits (PDKs) ? essential to fully achieve the requirements of military, aerospace, and government applications.

Ansys is deepening its technical collaboration with Intel Foundry by developing an enhanced thermal management flow with the RedHawk-SC platform, supporting the Intel 18A silicon manufacturing process. Intel 18A features revolutionary backside power delivery technology, PowerVia, that comes with new challenges for effectively cooling circuits, especially for high-performance computing, artificial intelligence (AI), and graphics processor chips. Ansys' mature and well-proven thermal solver technology provides predictive accuracy and the capacity for full-system analysis, resulting in better performance and greater design flexibility.

In addition, Intel Foundry and Ansys are collaborating to deliver signoff verification of thermal and power integrity and mechanical reliability of Intel's embedded multi-die interconnect bridge (EMIB) assembly technology. These capabilities span use-cases ranging from advanced silicon process nodes to various heterogenous packaging platforms.