Aehr Test Systems announced new customer has selected its FOX-PTM test and burn-in system to be used for qualification and production wafer level test and burn-in of their silicon carbide devices for automotive electric vehicles. This new customer, who is a supplier of silicon carbide and gallium nitride semiconductors, selected Aehr's FOX solution based on its proven ability to cost-effectively implement their target burn-in and stabilization requirements including 100% traceability that every device on the wafer is properly burned in. This customer will begin their device qualification using a world leading outsourced semiconductor assembly and test (OSAT) supplier that has partnered with Aehr and has FOX-P system capacity installed and capable of doing silicon carbide full wafer level test and burn-in of 100% of devices per wafer in a single insertion.

The customer will purchase the proprietary FOX WaferPakTM full wafer contactors and applications test programs from Aehr, and testing services from the assembly and test supplier for the initial device qualification. Upon qualification of the devices, the customer is expected to purchase new FOX-P system and WaferPak capacity directly from Aehr or through this OSAT. The FOX-XP and FOX-NP systems, available with multiple WaferPakContactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.