Aehr Test Systems announced a purchase order from a leading IC manufacturer for a custom FOX Multi-Wafer Test System WaferPakTM Contactor and evaluation activities that will enable the manufacturer to qualify Aehr Test's next-generation FOX-XP multi-wafer system and FOX WaferPakTM Contactor for production test and burn-in of its devices. The customer evaluation plan includes milestones for providing the WaferPak contactor, developing test plans and supporting correlation studies over the next two quarters. Aehr Test is developing the FOX-XP system, its next-generation multi-wafer test solution that is capable of functional test and burn-in/cycling of flash memories, microcontrollers and other ICs in wafer form before they are assembled into multi-die stacked packages.

These stacked packages can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, mission critical integrated circuits and sensors. The FOX-XP system utilizes Aehr Test's FOX WaferPak contactor, which provides a cost effective solution for making electrical contact with a full wafer or substrate in a multi-wafer environment. Aehr Test's WaferPak contactors contain up to 10s of thousands of probes to contact all devices on wafers and substrates up to 300mm simultaneously.

The FOX-XP system is being developed in configurations up to 25 wafers in parallel in a single system to operate within an efficient manufacturing space footprint. Aehr Test expects first shipments of the FOX-XP system by the latter part of calendar 2015.