Cheng Bin Zhang
Chief Tech/Sci/R&D Officer at Henghui Technology Corp. Ltd.
Profile
Cheng Bin Zhang is currently working as Manager-Research & Development at HENGHUI Technology Corp.
Ltd.
He completed his undergraduate degree from Qilu University of Technology.
Cheng Bin Zhang active positions
| Companies | Position | Start |
|---|---|---|
Henghui Technology Corp. Ltd.
 Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Chief Tech/Sci/R&D Officer | 01/01/2018 |
Training of Cheng Bin Zhang
| Qilu University of Technology | Undergraduate Degree |
Experiences
Positions held
Connections
1st degree connections
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
| Private companies | 1 |
|---|---|
Henghui Technology Corp. Ltd.
Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
- Stock Market
- Insiders
- Cheng Bin Zhang
