- Features
Special 3D structure that suppresses the reflection of light and improves yield
By further developing and fusing its microfabrication and optical design technologies, Toppan Printing has become the first company in the world to form a special 3D structure on the light-shielding black border on the surface of an EUV photomask and reduce the reflection of OOB light by approximately 70% compared with conventional products.
Transfer testing using EUV exposure machinery manufactured by ASML*3 has verified that this new EUV photomask can reduce dimension variability on silicon substrates by two-thirds. As a result, it enables improvements in quality and yield for semiconductor patterns.

Comparison of reflectance of conventional and next-generation EUV photomasks
(light-shielding black border)

Mask typeEUV light reflectanceOOB light reflectance
Conventional EUV photomaskLess than 0.05% (less than measurement limit)5-6%
Next-generation EUV photomaskLess than 0.05% (less than measurement limit)1.5% or less

- Future targets
Toppan Printing will begin sample shipments to its global semiconductor manufacturing clients during fiscal 2016. We will also further advance development, targeting commercialization and establishment as the industry standard from 2017, when mass production is scheduled to begin.

*1 EUV exposure
An exposure technology for transferring a semiconductor circuit pattern to a silicon substrate. It uses extreme ultraviolet light with a wavelength of 13.5 nanometers (1 nanometer=1 billionth of a meter).

*2 Light-shielding black border
Area located on the periphery of an EUV photomask pattern in which the unwanted reflection of EUV light is suppressed.

*3 ASML
Headquartered in the Netherlands, ASML is the world's only manufacturer of EUV exposure machinery for semiconductor manufacture.

*Patents are pending for the technologies described in this press release.
*The names of companies, products, and services featured in this press release are the trademarks or registered trademarks of the respective companies.
*The information in this press release is current as of the date of publication and is subject to change without notice.

Toppan Printing Co. Ltd. issued this content on 24 February 2016 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 24 February 2016 00:14:09 UTC

Original Document: http://www.toppan.co.jp/en/news/2016/02/newsrelease160224.html