Tokyo Seimitsu : Summary of FY2022/3 3rd Quarter Business Results with Note(April to December 2021)
February 02, 2022 at 02:49 pm IST
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Earnings Conference for FY2022/3 3Q (via Web)
Tokyo Seimitsu's Speakers
KAWAMURA Koichi, Representative Director and CFO TAKASHIMA Naoki, Management Support Dept Manager
This transcript is a translation of information given verbally in Japanese language and simplified.
2
FY2022/3 third quarter (3Q) results are as described above.
Accumulated Sales increased by more than 40% YoY, Profits doubled, and Operating Margin came to 21%.
Quarterly Sales also increased by 50% YoY, and Profits doubled.
SPE Sales and Profits are in line with forecast.
Strong Orders continued from the FY2022/3 thanks to demand for Memory, Display driver, and investment for Wafer capacity expansion, and as a result, 3Q Orders amount beat historical peak.
SPE Quarterly Sales exceeded ¥20BJPY, and Operating Margin reached ¥5BJPY for four (4) quarters sequentially.
Sales in 3Q were almost the same as in 2Q as excepted. We anticipate QoQ increase in 4Q.
3Q Operating Margin declined QoQ due to increase in material cost and other costs such as rental warehouse that are explained at earnings conference in November.
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Tokyo Seimitsu Co. Ltd. published this content on 02 February 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 02 February 2022 09:18:01 UTC.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.