Rohm and Haas Electronic Materials, CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global semiconductor industry, today announced two additions to its IC1000 pad line that offer reduced defect levels and improved cost of ownership in existing high volume manufacturing processes through advanced groove technology.

The IC1000 AT Defect Reduction Pad reduces defects through an innovative, patented groove design optimized for both wafer-scale and groove-scale fluid mechanics. The constant-area groove removes localized pressure on wafers to minimize scratches and defects, and demonstrates improved defectivity rates by up to 50 percent across both 200mm and 300mm platforms. The IC1000 AT Defect Reduction Pad is specifically designed for customers who require improved defectivity performance without having to qualify a new base pad material.

The IC1000? AT Long Life Pad provides lower cost-of-ownership and greater tool uptime. Its design ensures appropriate pad stiffness and slurry flow to maintain planarization and uniformity of performance without increasing slurry consumption. Moreover, the optimized groove design enables a 30 percent lifetime improvement, resulting in lower overall pad expenditures and greater throughput in volume production of all types of devices.

?These extensions of our IC1000 pad family directly address the changing needs of our semiconductor customers working in 90 nm and below,? said Cathie Markham, vice president of technology, Rohm and Haas Electronic Materials, CMP Technologies. ?The new pads offer improved lifetime and performance without necessitating a pad material change. A significant reduction in defects is obtained with our breakthrough groove technology, and customers achieve a greater competitive cost position with the Long Life pad.?

About Rohm and Haas Electronic Materials

Rohm and Haas Electronic Materials develops and delivers innovative material solutions and processes to the electronic and optoelectronic industries. Focused on the circuit board, semiconductor manufacturing, flat panel display and advanced packaging industries, its products and technologies are integral elements in electronic devices around the world.

The CMP Technologies business (formerly Rodel) has been a leader and innovator in polishing technology for the global semiconductor industry since 1969. CMP Technologies' products include polishing pads, conditioners and slurries. CMP Technologies maintains operations throughout the world, including manufacturing facilities in Newark, Delaware, Hsinchu, Taiwan and in the Mie and Kyoto prefectures in Japan. Additional information is available at http://rohmhaas.com.

About Rohm and Haas Company

Leading the way since 1909, Rohm and Haas (NYSE:ROH) is a global pioneer in the creation and development of innovative technologies and solutions for the specialty materials industry. The company's technologies are found in a wide range of markets including: Building and Construction, Electronics, Food and Retail, Household and Personal Care, Industrial Process, Packaging, Paper, Transportation and Water. Our innovative technologies and solutions help to improve life everyday, around the world. Based in Philadelphia, PA, the company generated annual sales of approximately $8.2 billion in 2006. Visit www.rohmhaas.com for more information. Imagine the possibilities?.

Safe Harbor Statement

This release includes forward-looking statements. Actual results could vary materially, due to changes in current expectations. The forward-looking statements contained in this announcement concern new products, product performance, corporate plans and development and involve risks and uncertainties and are subject to change.

Rohm and Haas Electronic Materials
CMP Technologies
Karen M. Winkelman, 602-470-4418
kmwinkelman@rohmhaas.com
or
Loomis Group
Jennifer Anselmo, 415-882-9494
anselmoj@loomisgroup.com